Thermal resistance of side by side multi-chip package: Thermal mode analysis

Dao Long Chen, Tei-Chen Chen, Ping Feng Yang, Yi Shao Lai

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

The thermal mode analysis is used in this paper to optimize the thermal management with optimal locations and chip sizes for multi-chip package. The average thermal resistance is defined and analyzed. The spreading thermal resistance can be expanded into Fourier series so that the thermal modes can be established. For the infinite thermal modes, only a few terms are needed to be considered due to the rapid convergence of solution. The optimal locations and chip sizes can then be determined by using the first few modes to reduce the thermal resistance as minimal as possible. The optimal locations have the cosine wave property so that the wave nodes might be the suitable sites. On the other hand, the optimal chip sizes have the cardinal sine property which decays monotonously. For given optimal locations, the optimal chip sizes are determined by certain modes. These special modes can be used to analyze the range of optimal locations and chip sizes.

Original languageEnglish
Pages (from-to)822-831
Number of pages10
JournalMicroelectronics Reliability
Volume55
Issue number5
DOIs
Publication statusPublished - 2015 Apr 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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