Abstract
Field emission displays (FED) must be annealed above 400 °C during the packaging process. Thermal stability of the active layer is the most significant issue for practical application, especially for the flat panel displays. The earlier experiments confirm that DLC films are suitable for applications in FED since they can be deposited via pulsed laser deposition to make them thermally stable up to 500 °C.
Original language | English |
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Pages (from-to) | 2424-2426 |
Number of pages | 3 |
Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 18 |
Issue number | 5 |
DOIs | |
Publication status | Published - 2000 Sept |
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering