Thermal stability of Cu/TiN and Cu/Ti/TiN metallizations on silicon

J. S. Chen, K. Y. Lu

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


The thermal stability of Cu/TiN and Cu/Ti/TiN metallizations on Si, before and after annealing at 450-750°C, was investigated. No change in sheet resistance and reverse-bias diode leakage current was observed for both systems after annealing up to 650°C. After annealing at 750°C, sheet resistance of Cu/TiN/〈Si〉 was doubled and formation of Cu3Si was observed by X-ray diffraction; on the contrary, the sheet resistance of the Cu/Ti/TiN/〈Si〉 sample remains unchanged and no Cu3Si is detected. By the same annealing, leakage current density of the diodes with Cu/TiN metallization increases by three orders of magnitude, and the value for diodes with Cu/Ti/TiN metallization also increases, but only by two orders of magnitude. The additional Ti layer thus improves the metallurgical and sheet resistance stability but it cannot completely prevent the diode leakage at high temperature.

Original languageEnglish
Pages (from-to)205-209
Number of pages5
JournalThin Solid Films
Issue number1-2
Publication statusPublished - 2001 Sep 21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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