Thermo-curable epoxy systems for nanoimprint lithography

Chun Chang Wu, Lien-Chung Hsu

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In this work, we have used solvent-free thermo-curable epoxy systems for low-pressure and moderate-temperature nanoimprint lithography (NIL). The curing kinetic parameters and conversion of diglycidyl ether of bisphenol A (DGEBA) resin with different ambient-cure 930 and 954 hardeners were studied by the isothermal DSC technique. They are useful for the study of epoxy resins in the imprinting application. The DGEBA/930 and DGEBA/954 epoxy resists can be imprinted to obtain high-density nano- and micro-scale patterns on a flexible indium tin oxide/poly(ethylene terephthalate) (ITO/PET) substrate. The DGEBA/930 epoxy resin is not only suitable for resist material, but also for plastic mold material. Highly dense nanometer patterns can be successfully imprinted using a UV-curable resist from the DGEBA/930 epoxy mold. Using the replicated DGEBA/930 epoxy mold instead of the expensive master can prevent brittle failure of the silicon molds in the NIL.

Original languageEnglish
Article number015006
JournalJournal of Micromechanics and Microengineering
Volume20
Issue number1
DOIs
Publication statusPublished - 2010 Jan 1

Fingerprint

Nanoimprint lithography
Ethers
Epoxy Resins
Epoxy resins
Plastic molds
Polyethylene Terephthalates
Molds
Silicon
Tin oxides
Kinetic parameters
Polyethylene terephthalates
Indium
Curing
2,2-bis(4-glycidyloxyphenyl)propane
Resins
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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Thermo-curable epoxy systems for nanoimprint lithography. / Wu, Chun Chang; Hsu, Lien-Chung.

In: Journal of Micromechanics and Microengineering, Vol. 20, No. 1, 015006, 01.01.2010.

Research output: Contribution to journalArticle

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