@inproceedings{1518ef00c886449f9b6ab6248ed256d7,
title = "Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications",
abstract = "Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.",
author = "Chen, {Kuo Shen} and Yang, {Tian Shiang} and Hong, {Ron Can} and Chiu, {Tz Cheng} and Wen, {Alex C.D.} and Li, {Chun Han} and Huang, {Chien Jung} and Chen, {Kun Tso} and Lin, {Mao Chi}",
note = "Funding Information: The first author gratefully acknowledges partial support of this work in this endeavor by the Ministry of Science and Technology of Taiwan through Grant No. MOST 103-2221-E-006-096-MY3. ITRI-NCKU research center, and Silicon Valley Foundation (USA) under Grant No.B104-K27. Publisher Copyright: {\textcopyright} 2016 IEEE.; 18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 ; Conference date: 30-05-2016 Through 02-06-2016",
year = "2016",
month = jul,
day = "15",
doi = "10.1109/DTIP.2016.7514879",
language = "English",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Yoshio Mita and Marta Rencz and Benoit Charlot and Peter Schneider and Niels Tas and Pascal Nouet and Francis Pressecq",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016",
address = "United States",
}