Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Kuo Shen Chen, Tian Shiang Yang, Ron Can Hong, Tz Cheng Chiu, Alex C.D. Wen, Chun Han Li, Chien Jung Huang, Kun Tso Chen, Mao Chi Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
EditorsYoshio Mita, Marta Rencz, Benoit Charlot, Peter Schneider, Niels Tas, Pascal Nouet, Francis Pressecq
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014576
DOIs
Publication statusPublished - 2016 Jul 15
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
Duration: 2016 May 302016 Jun 2

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Other

Other18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
CountryHungary
CityBudapest
Period16-05-3016-06-02

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T., & Lin, M. C. (2016). Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications. In Y. Mita, M. Rencz, B. Charlot, P. Schneider, N. Tas, P. Nouet, & F. Pressecq (Eds.), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 [7514879] (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2016.7514879