Abstract
The conjugate gradient method (CGM) and the general purpose commercial code CFX 4.2-based inverse algorithm are utilized in a three-dimensional inverse heat conduction problem to estimate the strength of heat generation for chips on a printed circuit board (PC-board). The mathematical formulations for simultaneously solving the strength of heat generation for multiple chips are derived. The advantage of calling the CFX 4.2 code as a subroutine in the present inverse calculation lies in that many difficult but practical three-dimensional inverse problems can be solved under this construction because the general-purpose commercial code has the ability to solve the direct problem easily. Results obtained by using the CGM to solve this three-dimensional inverse problem for two chips are justified based on the numerical experiments with the simulated exact and inexact measurements. It is concluded that accurate heat generation for each chip can be estimated simultaneously by the CGM except for the final time. The reason for and improvement of this singularity are addressed.
| Original language | English |
|---|---|
| Pages (from-to) | 439-446 |
| Number of pages | 8 |
| Journal | Journal of Thermophysics and Heat Transfer |
| Volume | 15 |
| Issue number | 1-4 |
| Publication status | Published - 2001 Oct |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
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Three-Dimensional Inverse Estimation of Heat Generation in Board Mounted Chips. / Huang, Cheng-Hung; Cheng, Shun Chung.
In: Journal of Thermophysics and Heat Transfer, Vol. 15, No. 1-4, 10.2001, p. 439-446.Research output: Contribution to journal › Article
TY - JOUR
T1 - Three-Dimensional Inverse Estimation of Heat Generation in Board Mounted Chips
AU - Huang, Cheng-Hung
AU - Cheng, Shun Chung
PY - 2001/10
Y1 - 2001/10
N2 - The conjugate gradient method (CGM) and the general purpose commercial code CFX 4.2-based inverse algorithm are utilized in a three-dimensional inverse heat conduction problem to estimate the strength of heat generation for chips on a printed circuit board (PC-board). The mathematical formulations for simultaneously solving the strength of heat generation for multiple chips are derived. The advantage of calling the CFX 4.2 code as a subroutine in the present inverse calculation lies in that many difficult but practical three-dimensional inverse problems can be solved under this construction because the general-purpose commercial code has the ability to solve the direct problem easily. Results obtained by using the CGM to solve this three-dimensional inverse problem for two chips are justified based on the numerical experiments with the simulated exact and inexact measurements. It is concluded that accurate heat generation for each chip can be estimated simultaneously by the CGM except for the final time. The reason for and improvement of this singularity are addressed.
AB - The conjugate gradient method (CGM) and the general purpose commercial code CFX 4.2-based inverse algorithm are utilized in a three-dimensional inverse heat conduction problem to estimate the strength of heat generation for chips on a printed circuit board (PC-board). The mathematical formulations for simultaneously solving the strength of heat generation for multiple chips are derived. The advantage of calling the CFX 4.2 code as a subroutine in the present inverse calculation lies in that many difficult but practical three-dimensional inverse problems can be solved under this construction because the general-purpose commercial code has the ability to solve the direct problem easily. Results obtained by using the CGM to solve this three-dimensional inverse problem for two chips are justified based on the numerical experiments with the simulated exact and inexact measurements. It is concluded that accurate heat generation for each chip can be estimated simultaneously by the CGM except for the final time. The reason for and improvement of this singularity are addressed.
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M3 - Article
AN - SCOPUS:0041780540
VL - 15
SP - 439
EP - 446
JO - Journal of Thermophysics and Heat Transfer
JF - Journal of Thermophysics and Heat Transfer
SN - 0887-8722
IS - 1-4
ER -