Tin whiskers of bulk solders generated under resonance

Jenn Ming Song, Truan-Sheng Lui, Yea Luen Chang, Li Hui Chen

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this study, we investigated the vibration properties of Sn-Zn and Sn-Zn-Al alloys. It is notable that, with a small amount of Al addition, Sn whiskers were generated during resonant vibration. This may be the first time that Sn whiskers were found on bulk materials. Microstmctural refining and hardening caused by alloying of Al stunted the fiberous type Sn deformation within Sn-Zn eutectics. Vibration-induced extrusion of Zn-free regions in the vicinity of cell boundaries may account for the appearance of the whiskers.

Original languageEnglish
Pages (from-to)1385-1388
Number of pages4
JournalJournal of Materials Research
Volume20
Issue number6
DOIs
Publication statusPublished - 2005 Jun 1

Fingerprint

Tin
solders
Alloying
Soldering alloys
Eutectics
Vibrations (mechanical)
Refining
Extrusion
Hardening
tin
resonant vibration
vibration
refining
eutectics
hardening
alloying
cells

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Song, Jenn Ming ; Lui, Truan-Sheng ; Chang, Yea Luen ; Chen, Li Hui. / Tin whiskers of bulk solders generated under resonance. In: Journal of Materials Research. 2005 ; Vol. 20, No. 6. pp. 1385-1388.
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Tin whiskers of bulk solders generated under resonance. / Song, Jenn Ming; Lui, Truan-Sheng; Chang, Yea Luen; Chen, Li Hui.

In: Journal of Materials Research, Vol. 20, No. 6, 01.06.2005, p. 1385-1388.

Research output: Contribution to journalArticle

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