Transient Thermal Analysis of Si-based Solar Cell Using Electrical Junction-Temperature Measurement and Impedance Spectroscopy

Yu Hsueh Chin; Shui-Jinn Wang; Chien Hsiung Hung; Ya Chi Huang; Chien-Hung Wu; Nai Sheng Wu; Hao Ping Yan

Transient Thermal Analysis of Si-based Solar Cell Using Electrical Junction-Temperature Measurement and Impedance Spectroscopy

Yu Hsueh Chin, Shui-Jinn Wang, Chien Hsiung Hung, Ya Chi Huang, Chien-Hung Wu, Nai Sheng Wu, Hao Ping Yan

Institute of Microelectronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2016 International Conference on Solid State Devices and Materials (SSDM’16)
Place of Publication	Tsukuba, Japan
Publication status	Published - 2016 Sept 26

Cite this

@inproceedings{0e24b023015d468bac653a97a15c9597,

title = "Transient Thermal Analysis of Si-based Solar Cell Using Electrical Junction-Temperature Measurement and Impedance Spectroscopy",

author = "Chin, {Yu Hsueh} and Shui-Jinn Wang and Hung, {Chien Hsiung} and Huang, {Ya Chi} and Chien-Hung Wu and Wu, {Nai Sheng} and Yan, {Hao Ping}",

year = "2016",

month = sep,

day = "26",

language = "English",

booktitle = "2016 International Conference on Solid State Devices and Materials (SSDM{\textquoteright}16)",

}

Transient Thermal Analysis of Si-based Solar Cell Using Electrical Junction-Temperature Measurement and Impedance Spectroscopy. / Chin, Yu Hsueh; Wang, Shui-Jinn; Hung, Chien Hsiung et al.
2016 International Conference on Solid State Devices and Materials (SSDM’16). Tsukuba, Japan, 2016.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Transient Thermal Analysis of Si-based Solar Cell Using Electrical Junction-Temperature Measurement and Impedance Spectroscopy

AU - Chin, Yu Hsueh

AU - Wang, Shui-Jinn

AU - Hung, Chien Hsiung

AU - Huang, Ya Chi

AU - Wu, Chien-Hung

AU - Wu, Nai Sheng

AU - Yan, Hao Ping

PY - 2016/9/26

Y1 - 2016/9/26

M3 - Conference contribution

BT - 2016 International Conference on Solid State Devices and Materials (SSDM’16)

CY - Tsukuba, Japan

ER -