Two-component injection molding of molded interconnect devices

Jyun Yi Chen, Wen-Bin Young

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Molded Interconnect Device (MID) can be defined as that an injection-molded plastic part combining with electrical and mechanical functions in a single device. This study is to examine the application of micro injection molding technology to the two-component molding process for the MID fabrication. The process involves the first shot of a plastic component with channel patterns on the surface. A second shot by micro injection molding technology is applied to fill the channel with the plateable plastics. The effects of the micro injection molding process parameters on filled line width of the two-component MID will be investigated. It is concluded that, for a MID component, the molding conditions must be designed carefully to keep the thickness variation below the allowable value. It is also found from the experiments that the thickness interference may in the range from 92 μm to 196 μm to have adequate molding at the second shot.

Original languageEnglish
Title of host publicationManufacturing Engineering and Technology for Manufacturing Growth
Pages78-82
Number of pages5
DOIs
Publication statusPublished - 2013 Feb 1
Event2012 International Conference on Manufacturing Engineering and Technology for Manufacturing Growth, METMG 2012 - San Diego, CA, United States
Duration: 2012 Nov 12012 Nov 2

Publication series

NameAdvanced Materials Research
Volume628
ISSN (Print)1022-6680

Other

Other2012 International Conference on Manufacturing Engineering and Technology for Manufacturing Growth, METMG 2012
CountryUnited States
CitySan Diego, CA
Period12-11-0112-11-02

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Chen, J. Y., & Young, W-B. (2013). Two-component injection molding of molded interconnect devices. In Manufacturing Engineering and Technology for Manufacturing Growth (pp. 78-82). (Advanced Materials Research; Vol. 628). https://doi.org/10.4028/www.scientific.net/AMR.628.78