Ultra-high thermal conductivity substrate for electronic components

Max L. Lake; Jyh-Ming Ting; Ronald L. Jacobsen; Alexandre G. Lagounov; Joseph M. Gottschlich

doi:10.4271/942186

Ultra-high thermal conductivity substrate for electronic components

Max L. Lake, Jyh-Ming Ting, Ronald L. Jacobsen, Alexandre G. Lagounov, Joseph M. Gottschlich

Research output: Contribution to conference › Paper › peer-review

1 Citation (Scopus)

Abstract

The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

Original language	English
DOIs	https://doi.org/10.4271/942186
Publication status	Published - 1994 Dec 1
Event	Aerotech'94 - Los Angeles, CA, United States Duration: 1994 Oct 3 → 1994 Oct 6

Other

Other	Aerotech'94
Country/Territory	United States
City	Los Angeles, CA
Period	94-10-03 → 94-10-06

All Science Journal Classification (ASJC) codes

Automotive Engineering
Safety, Risk, Reliability and Quality
Pollution
Industrial and Manufacturing Engineering

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10.4271/942186

Cite this

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title = "Ultra-high thermal conductivity substrate for electronic components",

abstract = "The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated {"}diamond/carbon/carbon composite,{"} consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.",

author = "Lake, {Max L.} and Jyh-Ming Ting and Jacobsen, {Ronald L.} and Lagounov, {Alexandre G.} and Gottschlich, {Joseph M.}",

year = "1994",

month = dec,

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note = "Aerotech'94 ; Conference date: 03-10-1994 Through 06-10-1994",

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AU - Lake, Max L.

AU - Ting, Jyh-Ming

AU - Jacobsen, Ronald L.

AU - Lagounov, Alexandre G.

AU - Gottschlich, Joseph M.

PY - 1994/12/1

Y1 - 1994/12/1

N2 - The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

AB - The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

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M3 - Paper

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Ultra-high thermal conductivity substrate for electronic components

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