Ultra-high thermal conductivity substrate for electronic components

Max L. Lake, Jyh-Ming Ting, Ronald L. Jacobsen, Alexandre G. Lagounov, Joseph M. Gottschlich

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

Original languageEnglish
DOIs
Publication statusPublished - 1994 Dec 1
EventAerotech'94 - Los Angeles, CA, United States
Duration: 1994 Oct 31994 Oct 6

Other

OtherAerotech'94
CountryUnited States
CityLos Angeles, CA
Period94-10-0394-10-06

Fingerprint

Diamonds
Thermal conductivity
Vapors
Substrates
Carbon carbon composites
Temperature control
Costs
Electronic equipment
Physical properties

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

Cite this

Lake, M. L., Ting, J-M., Jacobsen, R. L., Lagounov, A. G., & Gottschlich, J. M. (1994). Ultra-high thermal conductivity substrate for electronic components. Paper presented at Aerotech'94, Los Angeles, CA, United States. https://doi.org/10.4271/942186
Lake, Max L. ; Ting, Jyh-Ming ; Jacobsen, Ronald L. ; Lagounov, Alexandre G. ; Gottschlich, Joseph M. / Ultra-high thermal conductivity substrate for electronic components. Paper presented at Aerotech'94, Los Angeles, CA, United States.
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Lake, ML, Ting, J-M, Jacobsen, RL, Lagounov, AG & Gottschlich, JM 1994, 'Ultra-high thermal conductivity substrate for electronic components', Paper presented at Aerotech'94, Los Angeles, CA, United States, 94-10-03 - 94-10-06. https://doi.org/10.4271/942186

Ultra-high thermal conductivity substrate for electronic components. / Lake, Max L.; Ting, Jyh-Ming; Jacobsen, Ronald L.; Lagounov, Alexandre G.; Gottschlich, Joseph M.

1994. Paper presented at Aerotech'94, Los Angeles, CA, United States.

Research output: Contribution to conferencePaper

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AU - Lake, Max L.

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AU - Jacobsen, Ronald L.

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Lake ML, Ting J-M, Jacobsen RL, Lagounov AG, Gottschlich JM. Ultra-high thermal conductivity substrate for electronic components. 1994. Paper presented at Aerotech'94, Los Angeles, CA, United States. https://doi.org/10.4271/942186