Ultra-high thermal conductivity substrate for electronic components

Max L. Lake, Jyh-Ming Ting, Ronald L. Jacobsen, Alexandre G. Lagounov, Joseph M. Gottschlich

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Abstract

The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

Original languageEnglish
DOIs
Publication statusPublished - 1994 Dec 1
EventAerotech'94 - Los Angeles, CA, United States
Duration: 1994 Oct 31994 Oct 6

Other

OtherAerotech'94
CountryUnited States
CityLos Angeles, CA
Period94-10-0394-10-06

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

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