Ultra long needle geometry probe card development for wafer level test

Hao Yuan Chang, Wen-Fung Pan, Meng Kai Shih, Yi Shao Lai, Yu Cheng Tsao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Wafer level testing within MEMS DLP (Digital Light Processing) device is a key issue for the expected growth of the MEMS market. MEMS devices' wafer sorting is hard due to a series of difficult factors, including the height of the glass, device pitch and complicated processes. Therefore, the general needle card can't be used to probing for these devices. In this paper, we develop a new ultra long tip needle's geometry for DLP device testing. This paper conducts experimental and numerical investigation into the probing technique to test the functionality of DLP devices. A single needle three-dimensional computational probing simulation model was developed to find out the suitable design parameters of ultra long tip needle, analyzing the effects of the needle geometry on the scrub mark profile, the stress distribution during wafer probing and compare with general cantilever needle card. The experimental and numerical methods presented here can be used as useful performance evaluation tools to support the choice of suitable ultra long tip probe geometry and wafer testing parameters.

Original languageEnglish
Title of host publication2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
Pages78-81
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Other

Other2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

Fingerprint

Needles
Geometry
MEMS
Testing
Processing
Sorting
Stress concentration
Numerical methods
Glass

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Chang, H. Y., Pan, W-F., Shih, M. K., Lai, Y. S., & Tsao, Y. C. (2008). Ultra long needle geometry probe card development for wafer level test. In 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 (pp. 78-81). [4783812] (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008). https://doi.org/10.1109/IMPACT.2008.4783812
Chang, Hao Yuan ; Pan, Wen-Fung ; Shih, Meng Kai ; Lai, Yi Shao ; Tsao, Yu Cheng. / Ultra long needle geometry probe card development for wafer level test. 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. pp. 78-81 (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).
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abstract = "Wafer level testing within MEMS DLP (Digital Light Processing) device is a key issue for the expected growth of the MEMS market. MEMS devices' wafer sorting is hard due to a series of difficult factors, including the height of the glass, device pitch and complicated processes. Therefore, the general needle card can't be used to probing for these devices. In this paper, we develop a new ultra long tip needle's geometry for DLP device testing. This paper conducts experimental and numerical investigation into the probing technique to test the functionality of DLP devices. A single needle three-dimensional computational probing simulation model was developed to find out the suitable design parameters of ultra long tip needle, analyzing the effects of the needle geometry on the scrub mark profile, the stress distribution during wafer probing and compare with general cantilever needle card. The experimental and numerical methods presented here can be used as useful performance evaluation tools to support the choice of suitable ultra long tip probe geometry and wafer testing parameters.",
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Chang, HY, Pan, W-F, Shih, MK, Lai, YS & Tsao, YC 2008, Ultra long needle geometry probe card development for wafer level test. in 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008., 4783812, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, pp. 78-81, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, Taipei, Taiwan, 08-10-22. https://doi.org/10.1109/IMPACT.2008.4783812

Ultra long needle geometry probe card development for wafer level test. / Chang, Hao Yuan; Pan, Wen-Fung; Shih, Meng Kai; Lai, Yi Shao; Tsao, Yu Cheng.

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. p. 78-81 4783812 (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chang HY, Pan W-F, Shih MK, Lai YS, Tsao YC. Ultra long needle geometry probe card development for wafer level test. In 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. 2008. p. 78-81. 4783812. (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008). https://doi.org/10.1109/IMPACT.2008.4783812