Ultrasound assisted laser machining and surface cleaning

Chi Cheng Chiu, Chih Hao Chang, Yung-Chun Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper investigates a new approach of using ultrasound to assist material ablation efficiency in laser machining processes. Typical laser machining methods suffer a common problem that the laser-ablated material particles will fall back to the sample surface and therefore either deter subsequent laser machining process or result in material debris on sample surface. In this work we introduce high frequency mechanical vibration, or ultrasound, to the sample under laser machining. The oscillation of sample surface can eject laser-ablated particles and therefore achieve both purposes of surface cleaning and machining speed increasing. Preliminary experimental results have support the feasibility of the propose method which can effectively improve machining quality in most laser machining for a wide variety of materials.

Original languageEnglish
Title of host publication2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Pages872-875
Number of pages4
DOIs
Publication statusPublished - 2010 Nov 29
Event5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
Duration: 2010 Jan 202010 Jan 23

Publication series

Name2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Country/TerritoryChina
CityXiamen
Period10-01-2010-01-23

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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