Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder

H. C. Yang; Tz-Cheng Chiu

doi:10.1109/IMPACT.2010.5699575

Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder

H. C. Yang, Tz-Cheng Chiu

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable for the proposed constitutive model. The model constants are determined from curve fitting constant strain-rate experiment results. A numerical model based on the new unified viscoplastic constitutive model was applied to simulate various loading histories and compared to experimental test results, and to numerical predictions obtained by using the Anand viscoplastic model.

Original language	English
Title of host publication	International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs	https://doi.org/10.1109/IMPACT.2010.5699575
Publication status	Published - 2010
Event	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan Duration: 2010 Oct 20 → 2010 Oct 22

Other

Other	2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Country	Taiwan
City	Taipei
Period	10-10-20 → 10-10-22

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/IMPACT.2010.5699575

Fingerprint Dive into the research topics of 'Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder'. Together they form a unique fingerprint.

Cite this

@inproceedings{3b820d5209544de3aec0f7b8042ac31d,

title = "Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder",

abstract = "The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable for the proposed constitutive model. The model constants are determined from curve fitting constant strain-rate experiment results. A numerical model based on the new unified viscoplastic constitutive model was applied to simulate various loading histories and compared to experimental test results, and to numerical predictions obtained by using the Anand viscoplastic model.",

author = "Yang, {H. C.} and Tz-Cheng Chiu",

year = "2010",

doi = "10.1109/IMPACT.2010.5699575",

language = "English",

isbn = "9781424497836",

booktitle = "International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings",

note = "2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference ; Conference date: 20-10-2010 Through 22-10-2010",

}

Yang, HC & Chiu, T-C 2010, Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder. in International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings., 5699575, 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Taipei, Taiwan, 10-10-20. https://doi.org/10.1109/IMPACT.2010.5699575

TY - GEN

T1 - Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder

AU - Yang, H. C.

AU - Chiu, Tz-Cheng

PY - 2010

Y1 - 2010

N2 - The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable for the proposed constitutive model. The model constants are determined from curve fitting constant strain-rate experiment results. A numerical model based on the new unified viscoplastic constitutive model was applied to simulate various loading histories and compared to experimental test results, and to numerical predictions obtained by using the Anand viscoplastic model.

AB - The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable for the proposed constitutive model. The model constants are determined from curve fitting constant strain-rate experiment results. A numerical model based on the new unified viscoplastic constitutive model was applied to simulate various loading histories and compared to experimental test results, and to numerical predictions obtained by using the Anand viscoplastic model.

UR - http://www.scopus.com/inward/record.url?scp=79951595733&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79951595733&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2010.5699575

DO - 10.1109/IMPACT.2010.5699575

M3 - Conference contribution

AN - SCOPUS:79951595733

SN - 9781424497836

BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference

Y2 - 20 October 2010 through 22 October 2010

ER -