Unified viscoplastic constitutive model for Sn3.8Ag0.7Cu solder

H. C. Yang, Tz-Cheng Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The time-independent plastic and time-dependent creep deformations of Sn3.8Ag0.7Cu solder are considered in a unified framework by using a state variable approach. A new viscoplastic constitutive model that includes the kinematic hardening behavior of solder is proposed in this paper. Back stress, which is used for characterizing the kinematic hardening behavior, is selected as the state variable for the proposed constitutive model. The model constants are determined from curve fitting constant strain-rate experiment results. A numerical model based on the new unified viscoplastic constitutive model was applied to simulate various loading histories and compared to experimental test results, and to numerical predictions obtained by using the Anand viscoplastic model.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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