Use of BN-coated copper nanowires in nanocomposites with enhanced thermal conductivity and electrical insulation

Yongcun Zhou, Feng Liu, Chia Yun Chen

Research output: Contribution to journalArticlepeer-review

42 Citations (Scopus)

Abstract

Copper nanowires (CuNWs), as one-dimensional nanostructures, could be highly helpful as thermal management tools because of inherent thermal conductivity, high aspect ratio, and low cost. In this study, boron nitride-coated copper nanowires (CuNWs@BN) were successfully synthesized by an amenable and rapid technique and incorporated into synthetic polyimide (PI) to increase thermal conductivity while providing electrical insulation to nanocomposites. Maximal thermal conductivity in CuNWs@BN/PI composites containing fillers loading up to 20% volume rose to 4.12 W/mK, indicating an amelioration of 23 times in comparison with that of pure PI, while volume resistivity remained greater than 4.8 × 1013 Ω cm. Such nanocomposites with high thermal conductivity and electrical insulation could constitute important tools for thermal management. [Figure not available: see fulltext.]

Original languageEnglish
Pages (from-to)46-50
Number of pages5
JournalAdvanced Composites and Hybrid Materials
Volume2
Issue number1
DOIs
Publication statusPublished - 2019 Mar 15

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry
  • Polymers and Plastics
  • Materials Science (miscellaneous)

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