Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

Hon Yi Kuo; Shui Jinn Wang; Pei Ren Wang; Kai Ming Uang; Tron Min Chen; Shiue Lung Chen; Wei Chi Lee; Hong Kuei Hsu; Jui Chiang Chou; Chung Han Wu

doi:10.1109/LPT.2008.918880

Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

Hon Yi Kuo, Shui Jinn Wang, Pei Ren Wang, Kai Ming Uang, Tron Min Chen, Shiue Lung Chen, Wei Chi Lee, Hong Kuei Hsu, Jui Chiang Chou, Chung Han Wu

Institute of Microelectronics

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

Abstract

Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (Flex-LEDs) was proposed and demonstrated. It showed that the Flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 × 600 μm² showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.

Original language	English
Pages (from-to)	523-525
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	20
Issue number	7
DOIs	https://doi.org/10.1109/LPT.2008.918880
Publication status	Published - 2008 Apr 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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10.1109/LPT.2008.918880

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title = "Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate",

abstract = "Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (Flex-LEDs) was proposed and demonstrated. It showed that the Flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 × 600 μm2 showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.",

author = "Kuo, {Hon Yi} and Wang, {Shui Jinn} and Wang, {Pei Ren} and Uang, {Kai Ming} and Chen, {Tron Min} and Chen, {Shiue Lung} and Lee, {Wei Chi} and Hsu, {Hong Kuei} and Chou, {Jui Chiang} and Wu, {Chung Han}",

note = "Funding Information: Manuscript received October 16, 2007; revised December 2, 2007. This work was supported in part by the National Science Council of Taiwan, R.O.C., under Contract NSC 95-2215-E-006-014 and the Landmark Project Grant for NCKU{\textquoteright}s Top-University Project.",

year = "2008",

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doi = "10.1109/LPT.2008.918880",

language = "English",

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T1 - Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

AU - Kuo, Hon Yi

AU - Wang, Shui Jinn

AU - Wang, Pei Ren

AU - Uang, Kai Ming

AU - Chen, Tron Min

AU - Chen, Shiue Lung

AU - Lee, Wei Chi

AU - Hsu, Hong Kuei

AU - Chou, Jui Chiang

AU - Wu, Chung Han

N1 - Funding Information: Manuscript received October 16, 2007; revised December 2, 2007. This work was supported in part by the National Science Council of Taiwan, R.O.C., under Contract NSC 95-2215-E-006-014 and the Landmark Project Grant for NCKU’s Top-University Project.

PY - 2008/4/1

Y1 - 2008/4/1

N2 - Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (Flex-LEDs) was proposed and demonstrated. It showed that the Flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 × 600 μm2 showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.

AB - Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (Flex-LEDs) was proposed and demonstrated. It showed that the Flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 × 600 μm2 showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.

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Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

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