Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

Hon Yi Kuo, Shui Jinn Wang, Pei Ren Wang, Kai Ming Uang, Tron Min Chen, Shiue Lung Chen, Wei Chi Lee, Hong Kuei Hsu, Jui Chiang Chou, Chung Han Wu

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

Through the use of elastic conductive adhesive (ECA) as the bonding agent and patterned laser lift-off technology, a flexible metal substrate technology for the fabrication of vertical structured GaN-based light-emitting diodes (Flex-LEDs) was proposed and demonstrated. It showed that the Flex-LEDs have negligible changes in dominant wavelength-current and light output intensity-current-voltage characteristics when subjected to an external bending stress, indicating that the ECA used in the present technology performed well as a buffer to external stresses. As compared with conventional sapphire substrate GaN-based LEDs, Flex-LEDs with a chip size of 600 × 600 μm2 showed an increase in light output intensity (power) about 216% (80%) at 120 mA with an essential decrease in forward voltage from 3.51 to 3.3 V.

Original languageEnglish
Pages (from-to)523-525
Number of pages3
JournalIEEE Photonics Technology Letters
Volume20
Issue number7
DOIs
Publication statusPublished - 2008 Apr 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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