Use of highly reflective ohmic contact and surface KrF laser roughening to improve light output of vertical gan-based light-emitting diodes

Wei C. Lee, Kai Ming Uang, Der Ming Kuo, Jui Chiang Chou, Tron M. Chen, Hon Y. Kuo, Shui-Jinn Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A highly reflective ohmic contact and surface roughening by KrF excimer laser technique to improve the optoelectronic properties of high-power Vertical Metallic-substrate GaN-based light-emitting diodes (VM-LEDs) were proposed and investigated. A metal system comprising of Ni/Ag/Ni was employed to serve as a reflector and ohmic contact to p-GaN, which exhibits a good ohmic contact (3.05x10-4 ωcm2) and high reflectivity (89% at the wavelength of 465 nm) after thermal annealing at 500°C in N2 ambient for 10 min. After the removal of sapphire using laser lift-off process (LLO) [1], KrF excimer laser irradiation was adopted to etch the u-GaN layer and then roughen the surface of the exposed n-GaN layer. As compared to regular lateral-structure GaN-based LEDs with ITO transparent conduction layer (TCL), the fabricated VM-LEDs with a chip size of 1000 μmx 1000 demonstrated a typical increase in light output power (Lop) (i.e., ΔLop/Lop) by 325.5% at 350 mA with a decrease in forward voltage (Vf) from 3.67 V down to 3.41 V. As compared to the VM-LEDs with u-GaN etching employing inductively coupled plasma, about 125% enhancement in Lop has been obtained at 350 mA from the proposed samples.

Original languageEnglish
Title of host publication66th DRC Device Research Conference Digest, DRC 2008
Pages141-142
Number of pages2
DOIs
Publication statusPublished - 2008
Event66th DRC Device Research Conference Digest, DRC 2008 - Santa Barbara, CA, United States
Duration: 2008 Jun 232008 Jun 25

Other

Other66th DRC Device Research Conference Digest, DRC 2008
CountryUnited States
CitySanta Barbara, CA
Period08-06-2308-06-25

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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