Using microgripper for adhesive bonding in automatic microassembly system

Ren-Jung Chang, C. C. Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

A PC-based visual-servoing automatic microassembly system was developed and tested. With compliant PU microgripper, regional-edge-statistics algorithm, and PD controller, a visual servoing system was implemented for gripping micro object, gluing adhesive, and operating adhesive bonding. The main specifications of the system are: gripping range of 60∼80μm , working space of 7mm×5.74mm×15mm , system bandwidth of 15 Hz. In the performance test, a copper wire with diameter 60μm was automatically gripped and transported for adhesive bonding with a copper wire of 380μm.

Original languageEnglish
Title of host publicationProceedings of the 2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007
Pages440-445
Number of pages6
DOIs
Publication statusPublished - 2007 Dec 18
Event2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007 - Harbin, China
Duration: 2007 Aug 52007 Aug 8

Publication series

NameProceedings of the 2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007

Other

Other2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007
CountryChina
CityHarbin
Period07-08-0507-08-08

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Software
  • Control and Systems Engineering
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Using microgripper for adhesive bonding in automatic microassembly system'. Together they form a unique fingerprint.

Cite this