TY - GEN
T1 - Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding
AU - Mimatsu, Hayata
AU - Mizuno, Jun
AU - Kasahara, Takashi
AU - Saito, Mikiko
AU - Nishikawa, Hiroshi
AU - Shoji, Shuichi
PY - 2012
Y1 - 2012
N2 - In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100°C and 250°C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.
AB - In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100°C and 250°C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.
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U2 - 10.1109/ICSJ.2012.6523449
DO - 10.1109/ICSJ.2012.6523449
M3 - Conference contribution
AN - SCOPUS:84879760570
SN - 9781467326551
T3 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
BT - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
T2 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Y2 - 10 December 2012 through 12 December 2012
ER -