Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion

This study has successfully established a simulation model for dicing tape expansion. COMSOL Multiphysics simulation software was used to investigate the spacing condition before separating the dies, and the Taguchi method was used to identify the key factors for increasing the spacing between dies. This study analyzed five factors of influence on the spacing of dies: the anisotropic properties of tapes, temperature, tapes, die thickness, and rising height of the die grip ring. According to the main effect plot, the main key factor was the rising height of the die grip ring. There was little impact of the anisotropic properties of the materials, temperature, tape, and die thickness on the spacing between dies (Δspacing) on the production line.