Utilizing an adaptive grey model for short-term time series forecasting: A case study of wafer-level packaging

Che Jung Chang, Der Chiang Li, Wen Li Dai, Chien Chih Chen

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)

Abstract

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

Original languageEnglish
Article number526806
JournalMathematical Problems in Engineering
Volume2013
DOIs
Publication statusPublished - 2013

All Science Journal Classification (ASJC) codes

  • Mathematics(all)
  • Engineering(all)

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