Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections

Engineering & Materials Science

• Surface treatment 100%
• Cleaning 89%
• Vacuum 84%
• Photoelectron spectroscopy 60%
• Contact angle 52%
• Carbon 27%
• Plating 26%
• Impurities 22%
• Ion bombardment 19%
• Photoelectrons 18%
• Atomic force microscopy 15%
• Molecules 11%
• Plasmas 10%
• Wavelength 10%
• Temperature 9%
• Chemical analysis 7%
• Geometry 7%
• Gases 6%
• Water 6%
• Experiments 4%

Chemical Compounds

• Vacuum 75%
• Photoelectron Spectroscopy 47%
• Surface 30%
• Surface Damage 23%
• Ion Bombardment 20%
• Photoelectron Spectrum 18%
• Chemical Species 17%
• Organic Molecule 14%
• Atomic Force Microscopy 12%
• Chemical Element 12%
• Wavelength 11%
• Cleavage 10%
• Plasma 9%
• Ambient Reaction Temperature 8%
• Gas 8%
• Carbon Atom 7%
• Reduction 7%
• Time 5%