Abstract
This paper benchmarks the performance of gate-all-around (GAA) MOSFETs against that of optimized silicon-on-insulator FinFETs at 10-nm gate length. Variability in transistor performance due to systematic and random variations is estimated with the aid of TCAD 3-D device simulations, for both device structures. The yield of six-transistor SRAM cells implemented with these advanced MOSFET structures is then investigated via a calibrated physically based compact model. The GAA MOSFET technology is projected to provide for 0.1 V lower minimum cell operating voltage with reduced cell area.
Original language | English |
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Article number | 6951350 |
Pages (from-to) | 3949-3954 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 61 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2014 Dec 1 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering