Vertically integrated electronic circuits via a combination of self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating processes

Tzung Fang Guo, Shun Chi Chang, Seungmoon Pyo, Yang Yang

Research output: Contribution to journalArticlepeer-review

63 Citations (Scopus)

Abstract

The advantages of polymers are the fabrication and patterning of ultra-large-area coatings. In this paper, an approach which combines self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating technologies for the fabrication of vertically integrated electronic circuits is successfully demonstrated. Through these processes, several layers of metal integrated circuits were deposited sequentially with polymer layers sandwiched between each layer of wires. Hence, one can build vertically integrated electronic components consisting of diodes, capacitors, resistors, and inductors with a relatively simple and low-cost technology.

Original languageEnglish
Pages (from-to)8142-8147
Number of pages6
JournalLangmuir
Volume18
Issue number21
DOIs
Publication statusPublished - 2002 Oct 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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