VGCF/carbon composites for thermal management

Max L. Lake, Jyh-Ming Ting, Bela Nagy

Research output: Contribution to journalConference articlepeer-review

Abstract

VGCF/Carbon composites have been shown to demonstrate high thermal conductivity, comparable to that of CVD diamond, implying utility in high performance electronic packaging. VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. Thermal performance for die cooling is frequently determined by the thermal impedance of the package, measured from the junction to ambient, φja, or jucntion to case, φjc. This paper reports the results of this test on VGCF/carbon composites with a 1D architecture.

Original languageEnglish
JournalSAE Technical Papers
DOIs
Publication statusPublished - 1999 Jan 1
EventAerospace Power Systems Conference - Mesa, AZ, United States
Duration: 1999 Apr 61999 Apr 8

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

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