Chia Wen Hsu, Chyanbin Hwu, Ting Hsiang Lo, Wan Yi Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Due to the intrinsic coupling phenomenon of anisotropic magneto-electro-elastic (MEE) materials, not too many commercial software can deal with the anisotropic MEE plates, especially for its associated vibration analysis. Usually, to get higher accuracy for a problem with holes and/or cracks very fine meshes near the crack tips or hole boundaries are required for the conventional finite element method (FEM) or boundary element method (BEM). In this study, by converting elastic to MEE with Stroh's complex variable formalism, using the anisotropic elastostatic fundamental solutions and employing the dual reciprocity method, a special boundary element method (SBEM) is developed to perform vibration analysis of anisotropic MEE plates with holes/cracks. Since the special fundamental solution used in SBEM satisfies the traction-free condition along the hole/crack boundaries, no meshes are required along the hole/crack surfaces. Moreover, this fundamental solution is expressed in terms of Stroh's formalism that preserves the same mathematical form for MEE and elastic materials. Only suitable matrix expansion, which includes the extra electric and magneto information, is needed for converting the associated elastic-BEM to MEE-BEM. The dual reciprocity method allows us to use the static fundamental solutions instead of the one for dynamic analysis which is not available for the MEE plates with holes/cracks. The vibration analysis includes free vibration, steady-state forced vibration and transient analysis. Since no commercial finite element software is available for the current problem, the correctness of our proposed SBEM is verified by the reduced cases of piezoelectric plates with holes/cracks. The numerical results show that the proposed SBEM is much more accurate and efficient than the conventional FEM and BEM. After the verification, general cases of anisotropic MEE plates with holes/cracks are illustrated to study their coupling behavior.

Original languageEnglish
Title of host publicationProceedings of the 29th International Congress on Sound and Vibration, ICSV 2023
EditorsEleonora Carletti
PublisherSociety of Acoustics
ISBN (Electronic)9788011034238
Publication statusPublished - 2023
Event29th International Congress on Sound and Vibration, ICSV 2023 - Prague, Czech Republic
Duration: 2023 Jul 92023 Jul 13

Publication series

NameProceedings of the International Congress on Sound and Vibration
ISSN (Electronic)2329-3675


Conference29th International Congress on Sound and Vibration, ICSV 2023
Country/TerritoryCzech Republic

All Science Journal Classification (ASJC) codes

  • Acoustics and Ultrasonics


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