Abstract
A striated deformation feature can be observed in Sn-Pb eutectic solder with higher Sn content or a coarse Sn-rich phase after the solder is subjected to a vibration test. This deformation feature may accelerate the life deterioration of Sn-Pb solder under vibration. A similar feature can be observed in lead-free Sn-3.5 mass%Ag eutectic solder. A very little crack can be observed around the deformation areas of an Sn-3.5 mass%Ag sample, and that is the main reason it possesses a lower crack growth rote than Sn-Pb solder. A comparison of the deflection vs. cyclic number (D-N) curves of Sn-Pb and Sn-Ag solders under an identical vibration push force or identical initial defection amplitude demonstrates that Sn-3.5 mass%Ag solder possesses better vibration fracture resistance than Sn-Pb solders. In the case of an identical vibration push force, the initial deflection amplitude of Sn-3.5 mass%Ag solder is significantly smaller than that of Sn-Pb solder, and it may improve the solder's vibration fracture resistance.
| Original language | English |
|---|---|
| Pages (from-to) | 2064-2070 |
| Number of pages | 7 |
| Journal | Materials Transactions |
| Volume | 42 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 2001 Oct |
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering