Visible-blind ultraviolet photodetectors based on NiO/ZnO NRs with poly-(N-vinylcarbazole) intermediate layer

De Wei Huang, Hsueh Pin Lin, Dung Ching Perng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study reports a hybrid visible-blind ultraviolet (UV) photodetectors (PDs) with a poly-(N-vinylcarbazole) (PVK) intermediate layer between the NiO thin film and ZnO nanorods (NRs). The insertion of a PVK buffer layer between the NiO thin film and ZnO NRs is able to effectively reduce leakage path and lower the recombination of photo-excited carriers at the interface. The best photo-responsivity of the n-ZnO/PVK/p-NiO PD was found to be as high as 57.31 AAV at a-3 V bias under UV illumination at 380 run, which corresponded to an external quantum efficiency of 1.87×104 %. The light-to-dark current ratios of the PD with and without the PVK intermediate layer at a reverse bias of 3 V are 3.32×102 and 12, respectively. The ZnO/PVK/NiO PD also exhibited UV-selective photo-response with an UV-to-visible rejection ratio (R380nm/R450nm) of more than 102. The proposed PD with a PVK intermediate layer has the potential for developing low-cost and high-performance UV PDs in sensing applications.

Original languageEnglish
Title of host publicationTechConnect Briefs 2018 - Informatics, Electronics and Microsystems
EditorsMatthew Laudon, Fiona Case, Bart Romanowicz, Fiona Case
PublisherTechConnect
Pages213-216
Number of pages4
ISBN (Electronic)9780998878256
Publication statusPublished - 2018 Jan 1
Event11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo,the 2018 SBIR/STTR Spring Innovation Conference, and the Defense TechConnect DTC Spring Conference - Anaheim, United States
Duration: 2018 May 132018 May 16

Publication series

NameTechConnect Briefs 2018 - Advanced Materials
Volume4

Other

Other11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo,the 2018 SBIR/STTR Spring Innovation Conference, and the Defense TechConnect DTC Spring Conference
Country/TerritoryUnited States
CityAnaheim
Period18-05-1318-05-16

All Science Journal Classification (ASJC) codes

  • General Materials Science

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