VLSI implementation of wireless bi-directional communication circuits for micro-stimulator

Research output: Contribution to journalConference article

5 Citations (Scopus)

Abstract

This paper presents the integrated circuit design for a wireless bi-directional transmission micro-stimulator. This implantable device includes an internal RF front-end circuit, a control circuits, a stimulator, and an on-chip transmitter. The operation of this system is to receive a 2 MHz AM modulated signal generated by external circuits. This signal includes the power and data necessary for the whole internal circuits. Through the internal circuits, a stable DC voltage and digital data can be extracted to stimulate neuromuscular stimulation. Besides, the system can acquire the biological sensing signal by means of on-chip transmitter. In this study, most of the integrated circuits for the implantable device have been verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.

Original languageEnglish
Pages (from-to)V57-V60
JournalProceedings - IEEE International Symposium on Circuits and Systems
Volume5
Publication statusPublished - 2003 Jul 14
EventProceedings of the 2003 IEEE International Symposium on Circuits and Systems - Bangkok, Thailand
Duration: 2003 May 252003 May 28

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Networks (circuits)
Communication
Transmitters
Integrated circuits
Electric potential
Integrated circuit design

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

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title = "VLSI implementation of wireless bi-directional communication circuits for micro-stimulator",
abstract = "This paper presents the integrated circuit design for a wireless bi-directional transmission micro-stimulator. This implantable device includes an internal RF front-end circuit, a control circuits, a stimulator, and an on-chip transmitter. The operation of this system is to receive a 2 MHz AM modulated signal generated by external circuits. This signal includes the power and data necessary for the whole internal circuits. Through the internal circuits, a stable DC voltage and digital data can be extracted to stimulate neuromuscular stimulation. Besides, the system can acquire the biological sensing signal by means of on-chip transmitter. In this study, most of the integrated circuits for the implantable device have been verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.",
author = "Lee, {Shuenn Yuh} and Lee, {Shyh Chyang} and Chen, {Jia Jin Jason}",
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AU - Lee, Shuenn Yuh

AU - Lee, Shyh Chyang

AU - Chen, Jia Jin Jason

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Y1 - 2003/7/14

N2 - This paper presents the integrated circuit design for a wireless bi-directional transmission micro-stimulator. This implantable device includes an internal RF front-end circuit, a control circuits, a stimulator, and an on-chip transmitter. The operation of this system is to receive a 2 MHz AM modulated signal generated by external circuits. This signal includes the power and data necessary for the whole internal circuits. Through the internal circuits, a stable DC voltage and digital data can be extracted to stimulate neuromuscular stimulation. Besides, the system can acquire the biological sensing signal by means of on-chip transmitter. In this study, most of the integrated circuits for the implantable device have been verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.

AB - This paper presents the integrated circuit design for a wireless bi-directional transmission micro-stimulator. This implantable device includes an internal RF front-end circuit, a control circuits, a stimulator, and an on-chip transmitter. The operation of this system is to receive a 2 MHz AM modulated signal generated by external circuits. This signal includes the power and data necessary for the whole internal circuits. Through the internal circuits, a stable DC voltage and digital data can be extracted to stimulate neuromuscular stimulation. Besides, the system can acquire the biological sensing signal by means of on-chip transmitter. In this study, most of the integrated circuits for the implantable device have been verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.

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