Warpage simulation for encapsulated package during post-mold curing process

H. W. Huang, T. C. Chiu, Y. S. Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this study the effects of polymerization conversion and chemical aging on the constitutive behavior and dimension change were characterized and modeled for a commercial epoxy molding compound. Numerical finite element models incorporating these physical and thermomechanical models were developed for simulating the warpage evolution of overmolded BGA packages during post-mold curing (PMC) process. The numerical results were compared to experimental Shadow Moiré analyses for validating the modeling methodology. From the analyses it was observed that, while the chemical aging of the molding compound contributed little to the total crosslinking reaction during molding and PMC, it has a significant influence on package warpage during and after the PMC process.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Huang, H. W., Chiu, T. C., & Lai, Y. S. (2010). Warpage simulation for encapsulated package during post-mold curing process. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699576] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699576