TY - GEN
T1 - Warpage simulation for encapsulated package during post-mold curing process
AU - Huang, H. W.
AU - Chiu, T. C.
AU - Lai, Y. S.
PY - 2010/12/1
Y1 - 2010/12/1
N2 - In this study the effects of polymerization conversion and chemical aging on the constitutive behavior and dimension change were characterized and modeled for a commercial epoxy molding compound. Numerical finite element models incorporating these physical and thermomechanical models were developed for simulating the warpage evolution of overmolded BGA packages during post-mold curing (PMC) process. The numerical results were compared to experimental Shadow Moiré analyses for validating the modeling methodology. From the analyses it was observed that, while the chemical aging of the molding compound contributed little to the total crosslinking reaction during molding and PMC, it has a significant influence on package warpage during and after the PMC process.
AB - In this study the effects of polymerization conversion and chemical aging on the constitutive behavior and dimension change were characterized and modeled for a commercial epoxy molding compound. Numerical finite element models incorporating these physical and thermomechanical models were developed for simulating the warpage evolution of overmolded BGA packages during post-mold curing (PMC) process. The numerical results were compared to experimental Shadow Moiré analyses for validating the modeling methodology. From the analyses it was observed that, while the chemical aging of the molding compound contributed little to the total crosslinking reaction during molding and PMC, it has a significant influence on package warpage during and after the PMC process.
UR - http://www.scopus.com/inward/record.url?scp=79951661692&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79951661692&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2010.5699576
DO - 10.1109/IMPACT.2010.5699576
M3 - Conference contribution
AN - SCOPUS:79951661692
SN - 9781424497836
T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Y2 - 20 October 2010 through 22 October 2010
ER -