The Si/Ti/Cu/electroless nickel/solder bump was produced incorporating wave soldering without flux. The most suitable wave soldering condition for depositing solder is presented. The material interactions occurring during wave soldering, afterwards reflow, and extended heat treatment were found to produce Ni3Sn2, Ni3Sn4, and Ni4Sn compounds between solder and electroless nickel deposit. The thickness of electroless nickel deposit required for being the barrier layer of the solder bump was investigated by reflow process.
|Number of pages||8|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2000|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering