Wave soldering bumping process incorporating electroless nickel UBM

Kwang Lung Lin, Jun Wen Chen

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


The Si/Ti/Cu/electroless nickel/solder bump was produced incorporating wave soldering without flux. The most suitable wave soldering condition for depositing solder is presented. The material interactions occurring during wave soldering, afterwards reflow, and extended heat treatment were found to produce Ni3Sn2, Ni3Sn4, and Ni4Sn compounds between solder and electroless nickel deposit. The thickness of electroless nickel deposit required for being the barrier layer of the solder bump was investigated by reflow process.

Original languageEnglish
Pages (from-to)143-150
Number of pages8
JournalIEEE Transactions on Components and Packaging Technologies
Issue number1
Publication statusPublished - 2000

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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