Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung, Jang Jien-Ming

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)

Abstract

The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.

Original languageEnglish
Pages (from-to)33-41
Number of pages9
JournalMaterials Chemistry and Physics
Volume38
Issue number1
DOIs
Publication statusPublished - 1994 Jun

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

Fingerprint

Dive into the research topics of 'Wetting behavior between solder and electroless nickel deposits'. Together they form a unique fingerprint.

Cite this