Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substrates

Kwang Lung Lin, Pei Chi Liu, Jenn Ming Song

Research output: Contribution to journalConference articlepeer-review

9 Citations (Scopus)

Abstract

This study investigated the wetting behavior of Cu and Ag with pure Sn and several Sn-Zn solders, including Sn-9Zn (abbreviated as Sn-Zn), Sn-8.55Zn-0.5Al (abbreviated as Sn-Zn-Al), and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga (abbreviated as Sn-Zn-Ag-Al-Ga). Results show that Sn-Zn solders exhibit better wettability with both Cu and Ag than pure Sn. The primary interfacial intermetallics in Sn-Zn are (Ag,Cu)Zn rather than (Ag,Cu)Sn. By way of alloying modification, the Sn-Zn-Ag-Al-Ga alloy exhibits the greater wetting behavior than other solders.

Original languageEnglish
Pages (from-to)1310-1313
Number of pages4
JournalProceedings - Electronic Components and Technology Conference
Volume2
Publication statusPublished - 2004 Jan 1
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: 2004 Jun 12004 Jun 4

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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