Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang Lung Lin; Chia Ling Shih

doi:10.1007/s11664-003-0242-8

Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang Lung Lin, Chia Ling Shih

Research output: Contribution to journal › Article › peer-review

66 Citations (Scopus)

Abstract

The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230 °C to 300 °C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn₃ compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.

Original language	English
Pages (from-to)	95-100
Number of pages	6
Journal	Journal of Electronic Materials
Volume	32
Issue number	2
DOIs	https://doi.org/10.1007/s11664-003-0242-8
Publication status	Published - 2003 Jan 22

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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AB - The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230 °C to 300 °C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.

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