Abstract
The interactions during wetting between an electroless Ni-Cu-P deposit and molten In-Sn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these two intermetallic compounds Ni3Sn4 was also formed with the 20In-80Sn system. The Ni3Sn4 dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the In-Sn solders in the temperature range of 250-325°C.
Original language | English |
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Pages (from-to) | 211-215 |
Number of pages | 5 |
Journal | IEEE Transactions on Components Packaging and Manufacturing Technology Part B |
Volume | 20 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1997 Aug |
All Science Journal Classification (ASJC) codes
- General Engineering