Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun Jen Chen, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

The interactions during wetting between an electroless Ni-Cu-P deposit and molten In-Sn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these two intermetallic compounds Ni3Sn4 was also formed with the 20In-80Sn system. The Ni3Sn4 dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the In-Sn solders in the temperature range of 250-325°C.

Original languageEnglish
Pages (from-to)211-215
Number of pages5
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part B
Volume20
Issue number3
DOIs
Publication statusPublished - 1997 Aug

All Science Journal Classification (ASJC) codes

  • General Engineering

Fingerprint

Dive into the research topics of 'Wetting interactions between the Ni-Cu-P deposit and In-Sn solders'. Together they form a unique fingerprint.

Cite this