TY - JOUR
T1 - Whisker inhibited Sn–Bi alloy coating on copper surface to increase copper bonding strength for signal loss reduction of PCB in high-frequency
AU - Zhou, Guoyun
AU - Tao, Yepei
AU - He, Wei
AU - Wang, Shouxu
AU - Hong, Yan
AU - Chen, Chia Yun
AU - Chen, Yuanming
AU - Wang, Chong
AU - Ma, Chaoying
AU - Guo, Shan
AU - Miao, Hua
AU - Zhou, Jinqun
N1 - Funding Information:
The authors would like to thank the financial support from National Natural Science Foundation of China (NO. 61974020 ), Deyang Sci&Tech Project (NO.2018CKC038) and Sichuan Province Sci&Tech Project (NO. 2019YFN0161).
Publisher Copyright:
© 2020 Elsevier B.V.
PY - 2020/5/30
Y1 - 2020/5/30
N2 - Introducing Bi in the coating of Sn on copper surfaces for chemical bonding with prepreg was proposed to inhibit the serious whisker growth of Sn in the post–application process. The desired bonding strength and low roughness of copper surfaces (Ra = 0.5 μm) coated with this Sn–Bi alloy were both obtained under characterizations of peeling strength test and roughness measurement. Scanning electron microscopy (SEM) and X–ray photoelectron spectroscopy (XPS) confirmed that the high bonding strength is related to the high content of SnO2 in as–coated Sn–Bi alloy and the plating time with 180 s gives rise to the optimized bonding strength. Agilent Vector Network Analyzer (VNA) affirmed the lower signal loss (7 dB/m@10 GHz) in comparison with that treated with conventional brown–oxidation. Accordingly, the Sn–Bi coating on copper surface is suggested to be a candidate for layer bonding in high frequency PCB.
AB - Introducing Bi in the coating of Sn on copper surfaces for chemical bonding with prepreg was proposed to inhibit the serious whisker growth of Sn in the post–application process. The desired bonding strength and low roughness of copper surfaces (Ra = 0.5 μm) coated with this Sn–Bi alloy were both obtained under characterizations of peeling strength test and roughness measurement. Scanning electron microscopy (SEM) and X–ray photoelectron spectroscopy (XPS) confirmed that the high bonding strength is related to the high content of SnO2 in as–coated Sn–Bi alloy and the plating time with 180 s gives rise to the optimized bonding strength. Agilent Vector Network Analyzer (VNA) affirmed the lower signal loss (7 dB/m@10 GHz) in comparison with that treated with conventional brown–oxidation. Accordingly, the Sn–Bi coating on copper surface is suggested to be a candidate for layer bonding in high frequency PCB.
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U2 - 10.1016/j.apsusc.2020.145718
DO - 10.1016/j.apsusc.2020.145718
M3 - Article
AN - SCOPUS:85079880425
SN - 0169-4332
VL - 513
JO - Applied Surface Science
JF - Applied Surface Science
M1 - 145718
ER -