Wire density effect on wire sweep analysis for IC packaging

Chien Chang Pei, Francis Su, Sheng-Jye Hwang, Du Yuan Huang, Huei-Huang Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Wire sweep, the deflection of wires during the mold flling stage, is an important phenomenon in IC packaging process. Various methodologies of wire sweep analysis have been introduced to get better prediction and match the experimental measurements by many researchers. Typical wire sweep analysis method grabs results of mold flow simulation to calculate the drag force applied on the wire and the amount of wire sweep. In the mold flow simulation, however, only the volume of epoxy molding compound is constructed and the wires are neglected because of the modeling complexit. In this way, i the wires are ver closed, the local flow field around the wire will be different That is, each wire can afect the downstream flow feld, the drag force magnitude of the downstream wires, even the wire sweep of all downstream wires and the wire sweep result will be wrong. This is the so-called wire densit effect. In order to know more about wire density effect a CFD software-FIDAP is used to perform several fow simulations: flow between two parallel plates with cylinder(s) inside and then the downstream velocit distribution can be investigated. According to the trend of downstream velocity recovery rate, the wire density effect can be observed. The faster the downstream velocity recover rate, the effect of upstream cylinder on downstream cylinder is smaller and then the wire densit effect is less signifcant. After a series of simulations, three conclusions can be drawn. First, since each flow around the wire will be reorganized, the velocity feld change caused by a wire only affect the next one downstream wire and doesn't extend to the other downstream wires. Second, the mold cavity thickness, or the mold cavity thickness/wire diameter ratio, plays a strong role in the determination of wire density effect importance. When the ratio is small, the wire density effect is less important. In contrast, when the ratio grows, the wire density effect should be considered for better wire sweep prediction. Third, the position of wire in the mold cavity thickness direction also affects the wire density effect but it's less signifcant compared with the mold cavity thickness.

Original languageEnglish
Title of host publication2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages160-165
Number of pages6
ISBN (Electronic)0780374347, 9780780374348
DOIs
Publication statusPublished - 2002 Jan 1
Event8th International Advanced Packaging Materials Symposium - Stone Mountain, United States
Duration: 2002 Mar 32002 Mar 6

Publication series

Name2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Other

Other8th International Advanced Packaging Materials Symposium
CountryUnited States
CityStone Mountain
Period02-03-0302-03-06

Fingerprint

Packaging
Wire
Flow simulation
Drag
Sheet molding compounds

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

Cite this

Pei, C. C., Su, F., Hwang, S-J., Huang, D. Y., & Lee, H-H. (2002). Wire density effect on wire sweep analysis for IC packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 160-165). [990380] (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISAPM.2002.990380
Pei, Chien Chang ; Su, Francis ; Hwang, Sheng-Jye ; Huang, Du Yuan ; Lee, Huei-Huang. / Wire density effect on wire sweep analysis for IC packaging. 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 160-165 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).
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Pei, CC, Su, F, Hwang, S-J, Huang, DY & Lee, H-H 2002, Wire density effect on wire sweep analysis for IC packaging. in 2002 Proceedings - 8th International Advanced Packaging Materials Symposium., 990380, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium, Institute of Electrical and Electronics Engineers Inc., pp. 160-165, 8th International Advanced Packaging Materials Symposium, Stone Mountain, United States, 02-03-03. https://doi.org/10.1109/ISAPM.2002.990380

Wire density effect on wire sweep analysis for IC packaging. / Pei, Chien Chang; Su, Francis; Hwang, Sheng-Jye; Huang, Du Yuan; Lee, Huei-Huang.

2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 160-165 990380 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Pei CC, Su F, Hwang S-J, Huang DY, Lee H-H. Wire density effect on wire sweep analysis for IC packaging. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc. 2002. p. 160-165. 990380. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). https://doi.org/10.1109/ISAPM.2002.990380