Yield enhancement by bad-die recycling and stacking with though-silicon vias

Yung Fa Chou, Ding Ming Kwai, Cheng Wen Wu

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Yield enhancement by bad-die recycling and stacking with though-silicon vias'. Together they form a unique fingerprint.

Engineering & Materials Science