先進封裝製程中晶粒偏移原因診斷與改善對策

Translated title of the thesis: Die-shift failure analysis and alleviation strategy for wafer reconstitution process of advanced packaging technology
  • 柳 昱丞

Student thesis: Master's Thesis

Abstract

Date of Award2017 Feb 9
Original languageChinese
SupervisorTian-Shiang Yang (Supervisor)

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