薄膜與矽穿孔對晶圓翹曲之影響

Translated title of the thesis: The Effects of Film and TSV on Wafer Warpage
  • 陳 思妤

Student thesis: Master's Thesis

Abstract

Date of Award2018 Jul 20
Original languageChinese
SupervisorJung-Hua Chou (Supervisor)

Cite this

薄膜與矽穿孔對晶圓翹曲之影響
思妤, 陳. (Author). 2018 Jul 20

Student thesis: Master's Thesis