2 5D堆疊式覆晶封裝結構之可靠度分析

Translated title of the thesis: Reliability Analysis of 2 5D Structure and Flip Chip Die Stacking Packaging
  • 黃 冠傑

Student thesis: Master's Thesis

Abstract

Date of Award2018 Jul 31
Original languageChinese
SupervisorWen-Fung Pan (Supervisor)

Cite this

2 5D堆疊式覆晶封裝結構之可靠度分析
冠傑, 黃. (Author). 2018 Jul 31

Student thesis: Master's Thesis