2 5D堆疊式覆晶封裝結構之可靠度分析

Translated title of the thesis: Reliability Analysis of 2 5D Structure and Flip Chip Die Stacking Packaging
  • 黃 冠傑

Student thesis: Master's Thesis

Date of Award2018 Jul 31
Original languageChinese
SupervisorWen-Fung Pan (Supervisor)

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