A Kinetic Study of Silver Nitrate and Copper Ion by Replacement Reaction

Abstract

This study is probing into the kinetic influence in silver-copper replacement reaction In order to reduce the contact resistance copper powder contact each other with the binder silver nanoparticles Silver nanoparticles will melt at 200℃ before copper powder is oxidized This mechanism can not only prevent copper from oxidized but enhance the conductivity Silver-copper powder is prepared by replacement reaction Through changing the content of silver nitrate the content of dispersant (PVP) reaction time and reaction temperature the result shows replacement reaction has an impact on the grain size Moreover the kinetic study can be analyzed The conclusion of this study represents when the molar ratio of silver nitrate to copper powder is 1:0 5 using ethylene glycol as solvent adding 0 5 wt % PVP at room temperature the reduction rate of silver particles could be controlled and forming nanostructure silver which has obvious branch structure The dendritic structure silver formed smaller and obvious branch structure When reaction time is 30 minutes there is enough time to produce silver nanoparticles obvious dendritic structure In the other side if the temperature of reaction is too low copper powder can’t be coated completely A weight percent of silver is more than 95% on the surface by energy dispersive spectrometer analysis This result shows silver nanostructure covered on copper in a good shape

Date of Award	2015 Feb 13
Original language	English
Supervisor	Wen-Shi Lee (Supervisor)