A Study on Chlorination and Electrical Current Induced Failure Mechanism of Fine Au/Pd-Coated Cu wires

Abstract

In this research gold and palladium layers are electroplated on the surface of copper wire as Au/Pd-coated wires (APCC wire) to improve corrosion resistance and to enhance oxidation resistance Chlorination test and power cycling test are conducted to discuss the difficulties in practical application and to reveal their deterioration mechanism At the same time three kinds of APCC wires with different grain sizes are used to explore the effect of grain size in the experiment In chlorination test both tensile strength and elongation decrease since chloride ions attack the surface of wires However if comparing APCC wires to those of Pd-coated and pure copper the coating layer still has a significant impact on the improvement of corrosion resistance In power cycling test voids appear on the interface of Pd layer and copper matrix As the number of cycle increases grain growth are induced by Joule’s heat which is produced by high current density Besides repeated thermal expansion effect results in fatigue which makes the whole system fail

Date of Award	2020
Original language	English
Supervisor	Fei-Yi Hung (Supervisor)