BOUNDARY ELEMENT ANALYSIS OF A PATCH-REPAIRED PLATE CONTAINING A HOLE

  • 吳 坤亦

Student thesis: Master's Thesis

Abstract

In engineering industries the usage of composites made of thin anisotropic layers is being increased rapidly Most of the convention analysis generally neglects the presence very thin adhesive material due to complicated modeling of thin layers; however it leads to failure in providing reliable assessment of the potential debonding which usually caused by the fracture of the adhesive layer This study presents the interlaminar stresses in thin layered anisotropic composites and the patch repair analysis of the composites by the Boundary Element Method (BEM) Thin adhesive layer has also been taken into account for the BEM modeling the current work applies the already existed self-regularization scheme which was presented by Y C Shiah to analyze thin anisotropic composites and the stress concentration factor (SCF) has compared for cases of with the presence of the adhesive layer and without the adhesive layer Few benchmark examples of the patch repair of the plate with a hole containing adhesive layer and without containing of the adhesive layer are analyzed to study the Stress Concentration Factor by the Boundary Element Method approach
Date of Award2018 Jul 5
Original languageEnglish
SupervisorYui-Chuin Shiah (Supervisor)

Cite this

BOUNDARY ELEMENT ANALYSIS OF A PATCH-REPAIRED PLATE CONTAINING A HOLE
坤亦, 吳. (Author). 2018 Jul 5

Student thesis: Master's Thesis