Exploring the Trend of Display Driver IC Package Test Technology – An example of Smart Phone

Abstract

Since 2017 the smart phone market has set off a wave of “full screen” The panel factory is the center to drive the transformation of the components related to the panel industry In order to improve the screen quality and display ratio for smart phone the display driver IC has changed from COG to Touch Display Driver Integration (TDDI) + Chip on Film (COF) The display driver IC is one of the key components that are indispensable for the panel If the IC design company can develop the roadmap together with the supplier in addition to allowing the supplier to focus on resource development priorities can it bring a clearer and visible future through technical communication? This study shows the future development trend of the display driver IC in the package test process from the perspective of industry experts through the expert prediction method of the modified Delphi method Through this research we will summarize the future development direction and recommendations and serve as a reference for driving IC for future related technology development material preparation and resource allocation

Date of Award	2019
Original language	English
Supervisor	Quey-Jen Yeh (Supervisor)