Formulation of Silver Nanopastes with Energetic Peroxides for Enhanced Cu-to-Cu Bonding

  • 蔡 博雅

Student thesis: Master's Thesis


Silver nanopastes have recently demonstrated their promising uses in the low-temperature copper-to-copper (Cu-to-Cu) bonding Suspension solutions of these nanoparticles allows the ambient process in the material transferring and patterning while the nanoscales particles exhibit the lower fusion temperature as compared with the bulk counterpart In this research an energetic reagent cumene hydroperoxide (CHP) is incorporated in the formulation of commercial silver nanopastes for the Cu-to-Cu bonding The thermal decomposition of CHP provides the additional joule heat that is in-situ released among silver nanoparticles XPS composition analysis indicates that the presence of CHP accelerates the removal of surfactants originally surrounding the silver nanoparticles More importantly the shear strength measurements reveal the remarkable enhancement in the Cu-to-Cu bonding from 8 8 MPa to 14 6 MPa under the hot pressing at 200oC Microstructures were also examined and analyzed by SEM XRD and the scanning thermal microscopy (SThM) Electric properties based on the Kelvin structure reveal the contact resistance of the Cu-to-Cu bonding remains the same between samples with and without CHP addition These results concluded the formulation of silver nanopastes with the addition of energetic CHP significantly enhanced the Cu-to-Cu bonding strength at the hot pressing temperature of 200oC with no loss in the electric performance
Date of Award2015 Aug 24
Original languageEnglish
SupervisorChangshu Kuo (Supervisor)

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