Structural Fracture Analysis and Improvement of Extra Thin QFN Electronic Packages in Test Socket

Abstract

In this paper the finite element software ANSYS is used to analyze the mechanical dynamic behavior of the extra thin QFN electronic packages in the test handler and the test socket The simulation results of the ANSYS is used to match actual experiment results and is used in the CAD software “SpaceClaim” to build the extra thin QFN electronic package models of test environment (Test Socket Pick Up Head … etc) Then the three-point bending test is conducted on the extra thin QFN electronic packages and the test result is compared with the ANSYS simulation to confirm the model reliability The electronic package body and the test slot are respectively used to compare the simulation results with the three-point bending test result of the QFN electronic package structure to confirm the reliability of the package body model Finally the thin QFN electronic package model is used to analyze and improve the irreversible destruction caused by the mechanical behavior such as the stress concentration and ultimate strain in the test environment It is also used to optimize the pick&place nozzle motor actuation parameters and the design change of the test socket assembly It has been shown that the QFN electronic package crack and die crack ratios are drastically reduced

Date of Award	2019
Original language	English
Supervisor	Wen-Fung Pan (Supervisor)