Thickness Effects on System Performance of Flat Plate Oscillating Heat Pipe

Abstract

Oscillating heat pipe (OHP) is a two-phase flow heat transfer device that uses the phase change of the working fluid to transfer heat This study shows that a copper flat plate oscillating heat pipe (FP-OHP) is used to visualize the flow phenomena and measure its thermal resistance 25% and 50% of the working fluid filling ratio can be smoothly started the thermal resistance also significantly decreasing with 120W power input 75% of filling ratio system won’t be started until input power is increased to 160W In addition the concept of thermal resistance in parallel is used to analyze the heat conduction path in this study and to understand ratio of heat conduction through the copper base plate as well as the working fluid It can be found that the calculation results have a tendency conforming to the experimental results Therefore the ideal hypothesis can be used to make an analysis of the FP-OHP heat conduction path Next make the flat plate oscillating heat pipes with different base plate thickness to conduct the experiment and calculate the heat conduction path It can be found that the Type 2 FP-OHP with a thinner thickness has a higher thermal resistance but the heat transfer through the working fluid is higher than that of Type 1 FP-OHP

Date of Award	2019
Original language	English
Supervisor	Tzong-Shyng Leu (Supervisor)