Using Taguchi Method to Analyze the Optimized Photoresistance Reduction of Semiconductor Front-End Process

  • 郭 哲豪

Student thesis: Doctoral Thesis

Abstract

In this paper Taguchi method is used to analyze the uniformity and variability of the film thickness after photoresist reduction in the semiconductor lithography process and compare the obtained data with the current production process to confirm the feasibility of the photoresist thickness after reduction The research content of this article is divided into two parts First the three control variables that affect film thickness uniformity and wafer surface are discussed Set up the data of the three control variables later find the optimized data and verify the difference and substitutability of the current production program and the reduction program through the statistical process control chart (SPC Chart) At the same time this article will also discuss the current parameter setting The behavior when the machine setting is exceeded According to Taguchi’s experimental design results when the amount of photoresist coating (RRC) is reduced and the amount of photoresist is increased it can effectively reduce the amount of photoresist but it must be matched with the rotation speed When the rotation speed is 0 during RRC ejection the surface of the wafer will be jagged Finally it is matched with the machine to test the film thickness twice a week and the value is recorded on the statistical process control chart It can effectively judge whether the machine is abnormal and solve the stability of the film thickness of the monitoring machine in time to confirm the reduction program Come to produce wafers without fear
Date of Award2020
Original languageEnglish
SupervisorWen-Fung Pan (Supervisor)

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