智慧半導體及永續製造學院

研究成果

每年研究成果 1995 2009 2010 2011 2012 2013 2014 2015 2016 2017 2025

• 268 Article
• 263 Conference contribution
• 10 Paper
• 8 Chapter
• 18 更多
  • 6 Conference article
  • 5 Review article
  • 3 Comment/debate
  • 2 Book
  • 2 Editorial

每年研究成果

每年研究成果

搜尋結果

• 2024

  Advancements And Obstacles in Hydrogen Fuel Cell Technology for Sustainable Transportation

  Ou, T-C., Azmi, M., Henry, W. & Yu, C., 2024 11月, The 21th Taiwan Power Electronics Conference & The 45th Symposium on Electrical Power Engineering. NCKU, Tainan, Taiwan

  研究成果: Conference contribution

• EcoFlyer：The hybrid petrol-electric vehicles of future smart cities

  Ou, T-C., Chuang, C. Y. & Kuo, H-Y., 2024 11月, The 21th Taiwan Power Electronics Conference & The 45th Symposium on Electrical Power Engineering. NCKU, Tainan, Taiwan

  研究成果: Conference contribution

• Manufacturing of PEEK-PDMS Composite Materials for Intervertebral Disc Implants

  Mie, H. C., Liu, Y-C. & Mizuno, J., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 23-24 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

  研究成果: Conference contribution

  • Polyether ether ketones 100%
  • Polydimethylsiloxane 90%
  • Polyether 73%
  • Implant 71%
  • Ether 49%

• 台灣氫能供應鏈的潛力分析研究

  Ou, T-C., Chiang, C-Y., Chen, L. C., Lai, J-S. & Ju, Z-C., 2024 11月, 第二十一屆台灣電力電子研討會暨第四十五屆中華民國電力工程研討會. 國立成功大學電機工程學系

  研究成果: Conference contribution

• 整合田口方法及基因演算法建立太陽光電故障之類神經網路預測模型

  Ou, T-C., Lin, C-M. & Tsai, C. W., 2024 11月, 第二十一屆台灣電力電子研討會暨第四十五屆中華民國電力工程研討會. 國立成功大學電機工程學系, 台南市

  研究成果: Conference contribution

• 整合材料與燃料之低碳飛機研究

  Ou, T-C., Lai, J-S., Shen, C-C. & Tsai, S-F., 2024 11月, 第二十一屆台灣電力電子研討會暨第四十五屆中華民國電力工程研討會. 國立成功大學電機工程學系

  研究成果: Conference contribution

• 整合風電與波浪發電之優勢與挑戰

  Ou, T-C., Ju, Z-C., Jhang, Y-W. & Chiang, C-Y., 2024 11月, 第二十一屆台灣電力電子研討會暨第四十五屆中華民國電力工程研討會. 國立成功大學電機工程學系

  研究成果: Conference contribution
• 2023

  Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices

  Nishikawa, H., Park, B., Saito, M. & Mizuno, J., 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers Inc., (24th European Microelectronics and Packaging Conference, EMPC 2023).

  研究成果: Conference contribution

  • Nanoporosity 100%
  • Semiconductor 81%
  • Energy gap 72%
  • Microstructure 71%
  • microstructure 62%

• Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

  Pétillot, A. Y. K., Shoji, S., Kawarada, H. & Mizuno, J., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 31-32 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

  研究成果: Conference contribution

  • Passivation 100%
  • Chemical Passivation 83%
  • Impurities 79%
  • Strength 52%
  • Carbonyl Group 36%

• Fabrication and Evaluation of Microfluidic Organic-Light Emitting Diode Having a Fluorine-Doped Tin Oxide Cathode

  Ikeda, R., Mizuno, J. & Kasahara, T., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 117-118 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

  研究成果: Conference contribution

  • Fluorine 100%
  • Tin oxides 99%
  • Organic light emitting diodes (OLED) 95%
  • Tin Oxide 77%
  • Microfluidics 76%

• Resonance Properties of Leaky SAW Higher Harmonics on LiTaO₃ Thin Plate Bonded to Quartz Substrate

  Morita, H., Suzuki, M., Kakio, S. & Mizuno, J., 2023, IUS 2023 - IEEE International Ultrasonics Symposium, Proceedings. IEEE Computer Society, (IEEE International Ultrasonics Symposium, IUS).

  研究成果: Conference contribution

  • thin plates 100%
  • quartz 75%
  • harmonics 59%
  • acoustics 49%
  • coefficients 23%

• 太陽能面板新型自動清洗系統開發與建置

  Ou, T-C., Huang, H. H., Huang, W. T., Yang, Y-M. & Cheng, T-H., 2023 12月 1, 第四十四屆中華民國電力工程研討會暨第二十屆台灣電力電子研討會. 臺北市

  研究成果: Conference contribution

  • cost 100%
  • solar power 81%
  • economic viability 79%
  • industry 77%
  • patent 72%

• 波浪能岸堤發電系統

  Ou, T-C., Hou, J. L., Quay, Y. J., Chen, S-E., Hsieh, Y. H. & Fang, S-T., 2023 12月 1, 第四十四屆中華民國電力工程研討會暨第二十屆台灣電力電子研討會. 臺北市

  研究成果: Conference contribution

  • wave energy 100%
  • power generation 97%
  • embankment 57%
  • coast 45%
  • electricity 33%

• 整合綠能與人工魚礁裝置之研究

  Ou, T-C., Hou, J. L., Chuang, Y-T. & Liu, C-Y., 2023 12月 1, 第四十四屆中華民國電力工程研討會暨第二十屆台灣電力電子研討會. 臺北市

  研究成果: Conference contribution

  • artificial reef 100%
  • wave energy 52%
  • alternative energy 46%
  • fish 45%
  • mooring system 37%

• 儲能系統聚合參與需量反應獎勵機制之研究

  Ou, T-C., Tieng, H., Fan, S-X., Chen, Y. S., Liu, Y. H. & Fan, Y-Z., 2023 12月 1, 第四十四屆中華民國電力工程研討會暨第二十屆台灣電力電子研討會. 臺北市

  研究成果: Conference contribution

  • energy storage 100%
  • incentive 80%
  • demand 53%
  • market price 18%
  • services 17%
• 2022

  A Communication Architecture to Observe and Partially Preserve Efficiency in Automated Production Systems*

  Wilch, J., Vogel-Heuser, B., Hsieh, Y. M. & Cheng, F. T., 2022, 2022 IEEE 18th International Conference on Automation Science and Engineering, CASE 2022. IEEE Computer Society, p. 335-340 6 p. (IEEE International Conference on Automation Science and Engineering; 卷 2022-August).

  研究成果: Conference contribution

  • Communication 100%
  • Health 29%
  • Internet 27%
  3 引文 斯高帕斯（Scopus）

• Analysis of Process Data for Remote Health Prediction in Distributed Automation Systems

  Hsieh, Y. M., Wilch, J., Lin, C. Y., Vogel-Heuser, B. & Cheng, F. T., 2022, 2022 IEEE 18th International Conference on Automation Science and Engineering, CASE 2022. IEEE Computer Society, p. 1289-1294 6 p. (IEEE International Conference on Automation Science and Engineering; 卷 2022-August).

  研究成果: Conference contribution

  • Predictive maintenance 100%
  • Automation 59%
  • Health 57%
  • Aging of materials 44%
  • Feature extraction 34%
  1 引文 斯高帕斯（Scopus）

• Development of a Novel Biomaterial for Spinal Implant Purpose

  Kishimoto, K., Shoji, S. & Mizuno, J., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 85-86 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • Biomaterials 100%
  • Implant 80%
  • Biomaterial 69%
  • Photoelectron spectroscopy 46%
  • Polymers 39%

• Green Microfluidic Electrogenerated Chemiluminescence Device Using 9,10-Diphenylanthracene as a Host Material

  Kato, E., Ishimatsu, R., Mizuno, J. & Kasahara, T., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 25-26 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • Chemiluminescence 93%
  • Microfluidics 70%
  • Green 46%
  • Doping (additives) 29%
  • Doping Material 29%

• Microfluidic Electrogenerated Chemiluminescenece Device Using a Wide-Energy-Gap Material

  Ichinohe, N., Ishimatsu, R., Mizuno, J. & Kasahara, T., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 21-22 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • Emitter coupled logic circuits 100%
  • Energy gap 82%
  • Fluorene 81%
  • Microfluidics 77%
  • Photoluminescence 56%
  1 引文 斯高帕斯（Scopus）

• Nano-Artifact Metrics Chip Mounting Technology for Edge AI Device Security

  Masago, H., Nodaka, H., Kishimoto, K., Kawai, A. Y., Shoji, S. & Mizuno, J., 2022, Proceedings - 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2022. IEEE Computer Society, (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2022-October).

  研究成果: Conference contribution

  • Quartz 100%
  • Surface treatment 94%
  • Mountings 94%
  • Plasmas 41%
  • Vacuum 39%

• Orange-Red Electrogenerated Chemiluminescence Cells Using Titanium Dioxide Nanoparticles Annealed at Different Temperatures

  Kawasaki, R., Ishimatsu, R., Okada, K., Mizuno, J. & Kasahara, T., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 27-28 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • TiO2 nanoparticles 100%
  • Chemiluminescence 97%
  • Fluorine 95%
  • Tin oxides 95%
  • Titanium Dioxide Nanoparticle 92%
  1 引文 斯高帕斯（Scopus）

• Post deposition treatment of thin film HfO₂dielectric for increased performance in MIM capacitors

  Petillot, A. Y. K., Shoji, S. & Mizuno, J., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 169-170 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • Capacitor 100%
  • Thin films 92%
  • Capacitors 77%
  • Dielectric Film 71%
  • Depth Profiling 60%

• Red Microfluidic Electrogenerated Chemiluminescence Device Using Tetraphenyldibenzoperiflanthene as a Guest Molecule

  Yamamoto, S., Ishimatsu, R., Okada, K., Kato, E., Mizuno, J. & Kasahara, T., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 23-24 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).

  研究成果: Conference contribution

  • Chemiluminescence 100%
  • Microfluidics 75%
  • Molecules 69%
  • Red 49%
  • Organic solvents 33%
  2 引文 斯高帕斯（Scopus）
• 2021

  Fabrication of micropatterned fish scale collagen scaffold using soft lithography for oral mucosa tissue engineering

  Kishimoto, K., Miwa, K., Suzuki, A., Yamaguchi, I., Kodama, Y., Suebsamarn, O., Shoji, S., Izumi, K. & Mizuno, J., 2021 5月 12, 2021 International Conference on Electronics Packaging, ICEP 2021. Institute of Electrical and Electronics Engineers Inc., p. 25-26 2 p. 9451912. (2021 International Conference on Electronics Packaging, ICEP 2021).

  研究成果: Conference contribution

  • Mucous Membrane 100%
  • Collagen 86%
  • tissue engineering 83%
  • Tissue engineering 81%
  • fishes 79%

• Study of Atomic Layer Deposition of hafnium oxide as an insulation layer on Cu for potential flip chip integration

  Kawai, A. Y., Kataza, S., Shoji, S. & Mizuno, J., 2021, 2021 IEEE CPMT Symposium Japan, ICSJ 2021. Institute of Electrical and Electronics Engineers Inc., p. 94-97 4 p. (2021 IEEE CPMT Symposium Japan, ICSJ 2021).

  研究成果: Conference contribution

  • Hafnium oxides 100%
  • Ultrathin films 91%
  • hafnium oxides 77%
  • Neutral Salt 75%
  • Ultrathin Film 69%

• The effect of solid-state nanoporous Cu bonding for power device

  Park, B., le Han, D., Saito, M., Mizuno, J. & Nishikawa, H., 2021 5月 12, 2021 International Conference on Electronics Packaging, ICEP 2021. Institute of Electrical and Electronics Engineers Inc., p. 159-160 2 p. 9451968. (2021 International Conference on Electronics Packaging, ICEP 2021).

  研究成果: Conference contribution

  • Nanoporosity 100%
  • solid state 80%
  • Dealloying 26%
  • Formic acid 22%
  • formic acid 21%
  1 引文 斯高帕斯（Scopus）
• 2020

  An Energy Operating System Adaptive for the Sustainable and Green Energy

  Lin, Y. B., Ma, C. C., Hsu, C. C., Ou, T. C., Cheng, T. C. & Chen, W. F., 2020 12月 8, Proceedings of 2020 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2020. Tran, X-T. & Bui, D-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 157-160 4 p. 9301701. (Proceedings of 2020 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2020).

  研究成果: Conference contribution

  • Renewable energy resources 100%

• An Energy Operating System Adaptive for The Sustainable And Green Energy

  Lin, Y. B., Ma, C-C., Hsu, C-C., Ou, T-C., Cheng, T. C. & Chen, W. F., 2020 12月 8, 2020 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS). Ha Long, Vietnam

  研究成果: Conference contribution

• Metal deposition using solutions on high-density and well-aligned CNTs

  Saito, M., Kuwae, H., Mizuno, J., Norimatsu, W., Kusunoki, M. & Nishikawae, H., 2020 9月 15, Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Institute of Electrical and Electronics Engineers Inc., 9229813. (Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020).

  研究成果: Conference contribution

  • carbon nanotubes 100%
  • Electrodeposition 97%
  • Conductivity 77%
  • Metals 74%
  • Velocity 64%

• Resonance Properties of Leaky SAW Harmonics on Bonded Dissimilar-Material Structures

  Asakawa, S., Suzuki, M., Kakio, S., Tezuka, A. & Mizuno, J., 2020 9月 7, IUS 2020 - International Ultrasonics Symposium, Proceedings. IEEE Computer Society, 9251535. (IEEE International Ultrasonics Symposium, IUS; 卷 2020-September).

  研究成果: Conference contribution

  • quartz 100%
  • harmonics 78%
  • bandwidth 26%
  • interdigital transducers 24%
  • acoustics 21%
  3 引文 斯高帕斯（Scopus）

• RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight

  Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2020 1月, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., p. 1238-1241 4 p. 9056181. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2020-January).

  研究成果: Conference contribution

  • Organic semiconductor materials 100%
  • organic semiconductors 69%
  • Microfluidics 65%
  • Light emitting diodes 60%
  • Quantum Dot 54%
  1 引文 斯高帕斯（Scopus）

• 通用型能源作業系統軟體開發與功能測試 Software Development and Function Test for EOS (Energy Operation System) Applications

  Ou, T-C., Ma, C-C., Hsu, C-C., Lee, C. L. & Cheng, T. C., 2020 9月, Proc. 41th Symp. Elect. Power Eng.. Taiwan

  研究成果: Conference contribution
• 2019

  Analysis of Longitudinal Leaky SAW on LiNbO₃ Thin Plate/Amorphous Layer/Quartz Structure

  Asakawa, S., Mizuno, J., Hayashi, J., Suzuki, M., Kakio, S., Tezuka, A., Kuwae, H., Yokota, H., Yonai, T. & Kishida, K., 2019 10月, 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Computer Society, p. 675-678 4 p. 8925870. (IEEE International Ultrasonics Symposium, IUS; 卷 2019-October).

  研究成果: Conference contribution

  • thin plates 100%
  • quartz 75%
  • attenuation 50%
  • Q factors 37%
  • acoustics 37%
  6 引文 斯高帕斯（Scopus）

• Bending-induced tunable threshold in random laser

  Lee, Y. J., Yeh, T. W., Yang, Z. P., Yao, Y. C., Chang, C. Y., Tsai, M. T. & Sheu, J. K., 2019, CLEO: Science and Innovations, CLEO_SI 2019. Optica Publishing Group (formerly OSA), (Optics InfoBase Conference Papers; 卷 Part F129-CLEO_SI 2019).

  研究成果: Conference contribution

  • Polyethylene terephthalates 100%
  • Nanowires 95%
  • Photons 91%
  • Light sources 83%
  • Photon 74%

• Bending-Induced Tunable Threshold in Random Laser

  Lee, Y. J., Yeh, T. W., Yang, Z. P., Yao, Y. C., Chang, C. Y., Tsai, M. T. & Sheu, J. K., 2019 5月, 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8750113. (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings).

  研究成果: Conference contribution

  • spectral emission 81%
  • Polyethylene terephthalates 79%
  • Polyethylene Terephthalates 76%
  • Nanowires 76%
  • Photons 72%

• Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

  Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 4月, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

  研究成果: Conference contribution

  • Atomic Layer Epitaxy 75%
  • Strength 41%
  • Metal 14%
  • Beer 12%
  • Metals 11%
  5 引文 斯高帕斯（Scopus）

• High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

  Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 6月, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

  研究成果: Conference contribution

  • Organic Semiconductors 92%
  • Quantum Dots 77%
  • Organic semiconductor materials 76%
  • Microfluidics 74%
  • Electroluminescence 74%
  2 引文 斯高帕斯（Scopus）

• New Era of Device Science

  Kasahara, T., Kuwae, H. & Mizuno, J., 2019 4月 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

  研究成果: Conference contribution

  • Organic light emitting diodes (OLED) 100%
  • Nanotechnology 58%
  • Semiconductor 51%
  • Luminescent devices 47%
  • Semiconductor materials 44%
  2 引文 斯高帕斯（Scopus）

• Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO₃/Quartz or LiNbO₃/Quartz Bonding toward 5G Surface Acoustic Wave Devices

  Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 4月, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

  研究成果: Conference contribution

  • Lithium tantalate 100%
  • Amorphous films 96%
  • Acoustic surface wave devices 91%
  • Amorphous Film 79%
  • Quartz 65%

• Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

  Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 5月, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., p. 41 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

  研究成果: Conference contribution

  • Atomic Layer Epitaxy 75%
  • Strength 20%

• Water-Electrokinetic Power Generation Device using Flexible Woody Carbon Film

  Maeda, S., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2019 1月, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019. Institute of Electrical and Electronics Engineers Inc., p. 233-236 4 p. 8870868. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2019-January).

  研究成果: Conference contribution

  • Carbon films 100%
  • Water power 90%
  • electrokinetics 77%
  • Thermal evaporation 54%
  • carbon 42%
  1 引文 斯高帕斯（Scopus）
• 2018

  Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

  Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 11月 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350. (2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings).

  研究成果: Conference contribution

  • Dealloying 100%
  • Electrodeposition 75%
  • Dissolution 61%
  • Nanoporosity 54%
  • Nanopores 17%

• Determination of coefficient of thermal expansion in high power GaN-based light-emitting diodes via optical coherent tomography

  Lee, Y. J., Yao, Y. C., Haung, Y. K. & Tsai, M. T., 2018, Advances in Intelligent Information Hiding and Multimedia Signal Processing - Proceedings of the 13th International Conference on Intelligent Information Hiding and Multimedia Signal Processing,. Pan, J-S., Tsai, P-W., Jain, L. C. & Watada, J. (編輯). Springer Science and Business Media Deutschland GmbH, p. 147-152 6 p. (Smart Innovation, Systems and Technologies; 卷 81).

  研究成果: Conference contribution

  • Thermal expansion 100%
  • Light emitting diodes 97%
  • Tomography 94%
  • Coefficients 73%
  • Packaging materials 49%

• Directly determining the coefficient of thermal expansion of high-power light-emitting diodes by optical coherence tomography

  Yeh, T. W., Chou, C. Y., Huang, C. Y., Yao, Y. C., Haung, Y. K., Tsai, M. T. & Lee, Y. J., 2018, CLEO: Applications and Technology, CLEO_AT 2018. Optica Publishing Group (formerly OSA), (Optics InfoBase Conference Papers; 卷 Part F92-CLEO_AT 2018).

  研究成果: Conference contribution

  • Power semiconductor diodes 100%
  • Optical tomography 98%
  • Thermal Expansion 76%
  • Thermal expansion 73%
  • Light emitting diodes 71%

• Directly Determining the Coefficient of Thermal Expansion of High-power Light-emitting Diodes by Optical Coherence Tomography

  Yeh, T. W., Chou, C. Y., Huang, C. Y., Yao, Y. C., Haung, Y. K., Tsai, M. T. & Lee, Y. J., 2018 8月 6, 2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8427020. (2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings).

  研究成果: Conference contribution

  • Power semiconductor diodes 100%
  • Optical tomography 98%
  • Thermal expansion 73%
  • Light emitting diodes 71%
  • thermal expansion 62%

• Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

  Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 6月 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

  研究成果: Conference contribution

  • TEM Image 89%
  • Microchannels 87%
  • Transmission electron microscopy 82%
  • Transparency 80%
  • Chemical reactions 79%

• High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

  Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2018 7月 2, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

  研究成果: Conference contribution

  • Aspect ratio 100%
  • Resins 96%
  • Thermosets 66%
  • Silica 55%
  • Hot Temperature 51%
  2 引文 斯高帕斯（Scopus）

• Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO ₃ Thin Plate Bonded to Quartz Substrate

  Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 12月 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, 8579715. (IEEE International Ultrasonics Symposium, IUS; 卷 2018-October).

  研究成果: Conference contribution

  • thin plates 100%
  • quartz 75%
  • attenuation 66%
  • Q factors 50%
  • acoustics 49%
  9 引文 斯高帕斯（Scopus）

• Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

  Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2018 7月 2, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

  研究成果: Conference contribution

  • Platinum 76%
  • Copper 53%
  • Temperature 26%
  • Ultrathin films 21%
  • Shear strength 12%
  3 引文 斯高帕斯（Scopus）