電機資訊學院

研究成果

每年研究成果 1972 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2025

• 11414 Article
• 6606 Conference contribution
• 888 Patent
• 856 Conference article
• 1267 更多
  • 623 Paper
  • 204 Editorial
  • 174 Chapter
  • 108 Review article
  • 76 Comment/debate
  • 40 Letter
  • 29 Book
  • 8 Foreword/postscript
  • 4 Short survey
  • 1 ???researchoutput.researchoutputtypes.workingpaper.preprint???

每年研究成果

每年研究成果

搜尋結果

• 2024

  2024 10th International Conference on Applied System Innovation (ICASI) 17-21 April 2024 in Kyoto, Japan

  Chang, S. J., Young, S. J., Lam, A. D. K. T., Ji, L. W. & Prior, S. D., 2024, 於: Proceedings of the 2024 10th International Conference on Applied System Innovation, ICASI 2024. p. II

  研究成果: Editorial › 同行評審

• Editorial for Special Issue on Pre-trained Large Language Models for Information Processing

  Wang, B., Kawahara, T., Li, H., Meng, H. & Wu, C. H., 2024 2月 12, 於: APSIPA Transactions on Signal and Information Processing. 13, 2, e105.

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• Guest Editorial: Special Issue on Talkative Power Conversion

  Liang, T. J. P. & Blanco, F. B. D., 2024, 於: IEEE Journal of Emerging and Selected Topics in Power Electronics. 12, 4, p. 3279 1 p.

  研究成果: Editorial › 同行評審
• 2023

  AI-Explained (Part I) [Guest Editorial]

  Chung, P. C., Dockhorn, A. & Huang, J. W., 2023 11月 1, 於: IEEE Computational Intelligence Magazine. 18, 4, p. 58-59 2 p.

  研究成果: Editorial › 同行評審

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• Editorial

  Chang, S. J., Young, S. J., Lam, A. D. K. T., Ji, L. W. & Prior, S. D., 2023, 於: 2023 9th International Conference on Applied System Innovation, ICASI 2023. p. II

  研究成果: Editorial › 同行評審

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• Editorial for “Simultaneous Acquisition of Diffusion Tensor and Dynamic Diffusion MRI”

  Wu, M. L. & Chung, H. W., 2023 4月, 於: Journal of Magnetic Resonance Imaging. 57, 4, p. 1093-1094 2 p.

  研究成果: Editorial › 同行評審

• Editorial JESTPE 10th Anniversary

  Liang, T. J. P., 2023 6月 1, 於: IEEE Journal of Emerging and Selected Topics in Power Electronics. 11, 3, p. 2396-2398 3 p.

  研究成果: Editorial › 同行評審

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• EDITORIAL MESSAGE: Track on Embedded Systems

  Santambrogio, M. D., Boukhobza, J. & Ho, C. C., 2023 3月 27, 於: Proceedings of the ACM Symposium on Applied Computing. p. 449-450 2 p.

  研究成果: Editorial › 同行評審

• Editorial Special Issue on Future of Power Electronics: Components, Circuits, and Systems

  Liang, T. J. P., Blaabjerg, F., Tan, D. & Ojo, O., 2023 6月 1, 於: IEEE Journal of Emerging and Selected Topics in Power Electronics. 11, 3, p. 2399 1 p.

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  2 引文 斯高帕斯（Scopus）

• Guest editorial: Convergence of digital twin and 6G enabled edge intelligence: Theories, algorithms and applications

  Wu, Y., Chen, X., Lyu, F., Chen, X., Huang, X., Gao, J., Dai, Y., Quek, T. Q. S. & Zhang, Y., 2023 2月 1, 於: China Communications. 20, 2, p. III-VI

  研究成果: Editorial › 同行評審

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  1 引文 斯高帕斯（Scopus）

• Guest Editorial: 6G Non-terrestrial Networks

  Fu, I. K., Liberg, O., Chatzinotas, S., Quek, T. Q. S. & Xiao, P., 2023 12月 1, 於: IEEE Wireless Communications. 30, 6, p. 10-11 2 p.

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• Guest Editorial: Intelligent Ultra-Reliable and Low-Latency Communications in 6G

  She, C., Duong, T. Q., Quek, T. Q. S., Viswanathan, H. & Lopez-Perez, D., 2023 4月 1, 於: IEEE Wireless Communications. 30, 2, p. 12-13 2 p.

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  2 引文 斯高帕斯（Scopus）

• Message from the Chairs

  Sudo, K., Kudoh, S., Ide, I. & Chu, W. T., 2023, 於: Proceedings of MVA 2023 - 18th International Conference on Machine Vision and Applications.

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• Message from the SustainCom 2023 General Chairs

  Quek, T. Q. S., Guo, B. & Wu, L., 2023, 於: Proceedings - 2023 IEEE International Conference on Parallel and Distributed Processing with Applications, Big Data and Cloud Computing, Sustainable Computing and Communications, Social Computing and Networking, ISPA/BDCloud/SocialCom/SustainCom 2023. p. xxx

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• Message from TPC

  Casaca, A., Abdelgawad, A. & Quek, T., 2023, 於: 2023 IEEE World Forum on Internet of Things: The Blue Planet: A Marriage of Sea and Space, WF-IoT 2023.

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• Preface

  Cheng, W. H., Chu, W. T., Hu, M. C., Liu, J., Kim, M. & Zhang, W., 2023 12月 6, 於: Proceedings of the 5th ACM International Conference on Multimedia in Asia, MMAsia 2023.

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• Preface

  Cheng, W. H. & Chu, W. T., 2023 12月 6, 於: Proceedings of the 5th ACM International Conference on Multimedia in Asia, MMAsia 2023 Workshops. p. III-IV

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• Preface

  Hsieh, S. Y., Hung, L. J. & Lee, C. W., 2023, 於: Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 13889 LNCS, p. v-vi

  研究成果: Editorial › 同行評審

• The International Magnetics Conference (INTERMAG) 2023 Preface

  Bohn, F., Hsieh, M. F., Lee, K. J., Rea, C., Spiesser, A. & Andrei, P., 2023, 於: Digests of the Intermag Conference. 2023-May

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• The International Magnetics Conference (INTERMAG) 2023 Preface-Short Papers

  Hsieh, M. F. & Petru Andrei, A., 2023, 於: 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings.

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• 2022

  Advanced Nanomaterials for Applications in Photonic and Sensor Devices

  Young, S. J., Chang, S. J. & Liu, Y. H., 2022, 於: Journal of Nanomaterials. 2022, 9895385.

  研究成果: Editorial › 同行評審

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  4 引文 斯高帕斯（Scopus）

• Editorial

  Chang, S. J., Young, S. J., Lam, A. D. K. T., Ji, L. W. & Prior, S. D., 2022, 於: Proceedings of the 2022 8th International Conference on Applied System Innovation, ICASI 2022. p. II

  研究成果: Editorial › 同行評審

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• Editorial for Special Issue “Advances in Hyperspectral Data Exploitation”

  Chang, C. I., Song, M., Yu, C., Wang, Y., Yu, H., Li, J., Wang, L., Li, H. C. & Li, X., 2022 10月, 於: Remote Sensing. 14, 20, 5111.

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  • advanced technology 100%
  • image classification 92%
  • hardware 83%
  • visualization 70%
  • sensor 58%
  2 引文 斯高帕斯（Scopus）

• EDITORIAL MESSAGE Track on Embedded Systems

  Boukhobza, J., Tseng, H. W. & Ho, C. C., 2022 4月 25, 於: Proceedings of the ACM Symposium on Applied Computing. p. 479-480 2 p.

  研究成果: Editorial › 同行評審

• Guest editorial: Maritime communications in 5G and beyond networks

  Li, J., Feng, W., Chen, Y., Wang, Y. & Quek, T. Q. S., 2022 9月 1, 於: China Communications. 19, 9, p. III-V

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  1 引文 斯高帕斯（Scopus）

• Guest Editorial: AI-enabled intelligent network for 5G and beyond

  Tseng, F. H., Chen, C. Y., Malekian, R., Nakano, T. & Zhang, Z., 2022 7月, 於: IET Communications. 16, 11, p. 1265-1267 3 p.

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  1 引文 斯高帕斯（Scopus）

• Guest Editorial Special Issue on Blockchain-Enabled Internet of Things

  Cao, B., Zhang, L., Quek, T. Q. S. & Yang, S., 2022 6月 1, 於: IEEE Internet of Things Journal. 9, 11, p. 7876-7878 3 p.

  研究成果: Editorial › 同行評審

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  1 引文 斯高帕斯（Scopus）

• Message from General Co-Chairs

  Tang, K. T. S. & Lee, S. Y., 2022, 於: BioCAS 2022 - IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Systems for a Better Future, Proceedings.

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• Message from the General and Program Chairs

  Hsieh, J. W., Lin, I. C. & Ono, T., 2022, 於: Proceedings - 2022 IEEE 11th Non-Volatile Memory Systems and Applications Symposium, NVMSA 2022. p. VIII

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• Message from the General Chairs: EUC 2022

  Niyato, D., Han, Z. & Quek, T. Q. S., 2022, 於: Proceedings - 2022 IEEE 20th International Conference on Embedded and Ubiquitous Computing, EUC 2022. p. VIII

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• Message from the General Chairs and Program Chairs

  Kuo, Y. H., Kao, H. Y., Huang, J. W., Hung, C. C., Lu, H. C. & Lin, C. C., 2022, 於: Proceedings - 2022 International Conference on Technologies and Applications of Artificial Intelligence, TAAI 2022. p. X-XI

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• Message from the General Co-Chairs

  Vu, P. T., Thinh, T. N., Lin, I. C. & Tuan, N. A., 2022, 於: Proceedings - 2022 9th NAFOSTED Conference on Information and Computer Science, NICS 2022. p. X

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• Message from the Technical Program Chairs

  Chu, W. T., Zheng, W. S., Carli, M., Dong, M., Jiang, Y. G. & Liu, W., 2022, 於: ICMEW 2022 - IEEE International Conference on Multimedia and Expo Workshops 2022, Proceedings.

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• Preface

  Hsieh, S. Y., Hung, L. J., Klasing, R., Lee, C. W. & Peng, S. L., 2022, 於: Communications in Computer and Information Science. 1723 CCIS, p. v-vi

  研究成果: Editorial › 同行評審

• Welcome Message from the Chair

  Chung, P. C. J., Tsao, T., Hu, S., Hwang, Y. T., Fan, C. P., Yang, D. G. C., Fong, B., Juang, C. F. & Huang, C. R., 2022, 於: RASSE 2022 - IEEE International Conference on Recent Advances in Systems Science and Engineering, Symposium Proceedings.

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• Welcome Message from the General Chairs

  Chu, W. T., Zheng, W. S., Carli, M., Dong, M., Jiang, Y. G. & Liu, W., 2022, 於: Proceedings - IEEE International Conference on Multimedia and Expo. 2022-July

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• Welcome Message ITC-Asia 2022

  Chang, S. J. & Huang, J. L., 2022, 於: Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022. p. VIII

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• 智简无线网络理论与技术

  Zhang, P., Peng, M., Cui, S., Zhang, Z., Mao, G., Quan, Z., Quek, T. Q. S. & Rong, B., 2022 1月, 於: Frontiers of Information Technology and Electronic Engineering. 23, 1

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  14 引文 斯高帕斯（Scopus）
• 2021

  A Mustard Seed Planted Years Ago Sprouts and Continues to Grow

  Olorunfemi Ojo, J., Peter Liang, T. J., Doolla, S., Harnefors, L., Yuen Ron Hui, S., Kawakami, N., Jason Lai, J. S., Lai, Y. S., Liu, Y. F., Maksimovic, D. & Molinas, M., 2021 2月, 於: IEEE Journal of Emerging and Selected Topics in Power Electronics. 9, 1, p. 3-6 4 p., 9330815.

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• Guest Editorial Special Issue on Recent Advancements of Power Electronics Technology and Applications

  Liang, T. J. P. & Hui, S. Y. R., 2021 12月 1, 於: IEEE Journal of Emerging and Selected Topics in Power Electronics. 9, 6, p. 6460-6461 2 p.

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• Message from the General Chairs and Program Chairs

  Kao, H. Y., Liao, H. C., Cheng, Y. H. & Wu, S. H., 2021, 於: Proceedings - 2021 International Conference on Technologies and Applications of Artificial Intelligence, TAAI 2021. p. xii

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• Message from the technical program chairs

  Chu, W. T., Liu, J. & Worring, M., 2021 8月 24, 於: ICMR 2021 - Proceedings of the 2021 International Conference on Multimedia Retrieval. p. IV

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• Preface

  Chen, C. Y., Hon, W. K., Hung, L. J. & Lee, C. W., 2021, 於: Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 13025 LNCS, p. v

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• Preface

  Neidhardt, J., Wörndl, W., Kuflik, T., Zanker, M., Bellogin, A., Bridge, D., Coba, L., Dietz, L. W., Goldenberg, D., Gretzel, U., Jannach, D., Krasnodebski, J., Massimo, D., Palomares, I., Moreno, A., Ricci, F., Sertkan, M., Sottocornola, G., Sánchez, P. & Werthner, H., 2021, 於: CEUR Workshop Proceedings. 2974, p. I

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• Preface and acknowledgements

  Peng, S. L., Hsieh, S. Y., Gopalakrishnan, S. & Duraisamy, B., 2021, 於: Lecture Notes in Networks and Systems. 248, p. xi-xii

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• The International Magnetics Conference (INTERMAG) 2021 Publications Chairs' Preface

  Andrei, P., Hsieh, M. F. & Piramanayagam, S. N., 2021, 於: Digests of the Intermag Conference. 2021-April

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• 2020

  Artificial-Intelligence-Driven Fog Radio Access Networks: Recent Advances and Future Trends

  Peng, M., Quek, T. Q. S., Mao, G., Ding, Z. & Wang, C., 2020 4月, 於: IEEE Wireless Communications. 27, 2, p. 12-13 2 p., 9085257.

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  20 引文 斯高帕斯（Scopus）

• Edge artificial intelligence in 6G systems: Theory, key techniques, and applications

  Zhao, Z., Ding, Z., Quek, T. Q. S. & Peng, M., 2020 8月, 於: China Communications. 17, 8, p. III-IV 9190124.

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  7 引文 斯高帕斯（Scopus）

• Editorial: Special Issue on Selected Papers from ISICAS 2020 Guest Editors' Introduction

  Atef, M., Hung, C. C., Jia, Y., Lee, S. Y. & Sahin, M., 2020 10月, 於: IEEE transactions on biomedical circuits and systems. 14, 5, p. 930 1 p., 9222825.

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• Editoril

  Chang, S. J., Young, S. J., Kin-Tak Lam, A. D., Wen Ji, L. & Prior, S. D. S. D., 2020 11月 5, 於: 2020 6th International Conference on Applied System Innovation, ICASI 2020. p. II 9426240.

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